Flexible OLED Display Thermal Conductive Pin Hole Structure

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Solution Overview

Problem

Flexible organic light-emitting display apparatuses face limitations in portability and screen size due to the use of heavy and fragile glass substrates, necessitating improved heat dissipation and reduced thickness for enhanced performance.

Innovation Solution

The organic light-emitting display apparatus includes a substrate with an organic light-emitting device, an encapsulation layer, a base layer with pin holes filled by a thermal conductive layer, an adhesive layer, and a heat dissipation layer, which may incorporate indium tin oxide (ITO) or carbon nanotubes, to efficiently dissipate heat and reduce thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If glass substrate is used, then structural strength is improved, but weight increases and portability deteriorates

Engineering Contradiction:

Improvestructural strengthVSAvoidweight

Core Design Contradiction:

StrengthVSWeight of moving object

Solution Approach 1:

The patent changes the substrate material from glass to flexible plastic substrate, fundamentally altering the physical parameters of the display apparatus. This enables the device to be bent and folded, dramatically improving portability while maintaining structural integrity through the flexible substrate design

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a flexible plastic substrate instead of rigid glass, allowing the display to be bent and folded into compact forms. The flexible substrate acts as a thin film that provides both structural support and portability, enabling portable electronic devices to achieve compact folding configurations

Inventive Principle:

Principle #30Flexible shells and thin films

2Strength

If glass substrate is used, then structural strength is improved, but device becomes fragile

Engineering Contradiction:

Improvestructural strengthVSAvoidfragility

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent changes the substrate material from brittle glass to flexible plastic, fundamentally altering the mechanical properties. This eliminates the fragility issue while maintaining structural strength through the flexible substrate's inherent durability and resistance to breakage

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

By using a flexible plastic substrate instead of rigid glass, the patent creates a device that is inherently more reliable and less prone to damage from drops or impacts. The flexible substrate absorbs mechanical stress without fracturing, significantly improving device reliability

Inventive Principle:

Principle #30Flexible shells and thin films

3Length of moving object

If thickness is reduced for portability, then portability is improved, but heat dissipation capability deteriorates

Engineering Contradiction:

ImprovethicknessVSAvoidheat dissipation capability

Core Design Contradiction:

Length of moving objectVSTemperature

Solution Approach 1:

The patent applies thermal conductive material specifically at the backlight unit location where heat is generated, rather than uniformly throughout the entire device. This localized heat dissipation approach effectively manages thermal issues while maintaining overall device thinness and portability

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent introduces a thermal conductive material as an intermediary substance between the backlight unit and the flexible substrate. This intermediary efficiently transfers heat away from the light source, enabling effective heat dissipation in a thin-profile device without compromising portability

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation and reduces the overall thickness of the display apparatus, improving its portability and performance by efficiently managing heat discharge through the use of thermal conductive materials and a transparent conductive heat dissipation layer.

Implementation Method 1

a thermal conductive layer filling the pin hole... to efficiently dissipate heat and reduce thickness... efficiently managing heat discharge through the use of thermal conductive materials

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat dissipation layer formed under the base layer to dissipate heat discharged through the thermal conductive layer

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS9356259B2Organic light-emitting display apparatus and method of manufacturing the same

Publication Date: 2016.05.31 SAMSUNG DISPLAY CO LTD

AI summary

Provided is an organic light-emitting display apparatus. The organic light-emitting display apparatus includes: a substrate; an organic light-emitting device provided on the substrate and comprising a first electrode, a second electrode, and an intermediate layer provided between the first electrode and the second electrode; an encapsulation layer covering the organic light-emitting device; a base layer disposed under the substrate and having a pin hole formed therein; and a thermal conductive layer filling the pin hole.