IGBT Module Housing With Integrated Sealing And Quick-Release Mounting
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Solution Overview
Problem
Existing protective packaging modules for electrical storage and switching devices in harsh environments are not scalable and increase downtime during service and repair, leading to increased costs and complexity.
Innovation Solution
A semiconductor module with a housing, support plate, and cover member forming a protective enclosure, featuring integrated attachment structures and sealing elements, which allows for easy assembly and disassembly, reducing downtime and improving scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing protective packaging modules are used to protect electrical storage and switching devices from harsh operating conditions, then reliability is improved, but ease of repair deteriorates and loss of time increases
Solution Approach 1:
The semiconductor module is divided into distinct functional components: a housing containing the semiconductor device, a heat sink for thermal management, and a protective enclosure with sealed interior space. This segmentation allows the semiconductor device to be protected within its own housing while enabling independent servicing of the module as a complete unit, resolving the contradiction between protection and ease of repair.
2Reliability
If existing protective packaging modules are used to protect electrical storage and switching devices, then reliability is improved, but loss of time during service and repair increases
Solution Approach 1:
The semiconductor device is pre-assembled within a sealed housing that includes integrated attachment structures and sealing elements before deployment. This preliminary assembly ensures that when service is needed, the entire protected unit can be quickly replaced or serviced as a complete module without requiring disassembly during the repair process, thus reducing downtime while maintaining protection.
3Object-affected harmful factors
If existing packaging methods are used, then protection is achieved, but device complexity and product cost increase
Solution Approach 1:
The housing, heat sink, and protective enclosure are merged into a single integrated semiconductor module with unified attachment structures. The housing simultaneously provides mechanical support, thermal management interface, and environmental sealing functions. This merging reduces the number of separate components and assembly steps compared to traditional multi-component packaging methods, simplifying the overall structure while maintaining comprehensive protection.
4Object-affected harmful factors
If existing packaging methods are used, then protection is achieved, but adaptability for particular application needs deteriorates
Solution Approach 1:
The semiconductor module housing incorporates universal attachment structures that can be adapted to various mounting configurations and application requirements. The standardized housing design with integrated mounting features allows the same protective enclosure to serve different semiconductor devices and be installed in various locations, providing scalability and versatility across different applications without requiring custom packaging solutions.
Data Source
AI summary
A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.