LED Package Thermal Management via Embedded Leadframe and Heat Sink
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED modules lack efficient heat dissipation structures, leading to inadequate thermal management as the number of LEDs increases, which can result in elevated temperatures and reduced operational reliability.
Innovation Solution
A package for mounting electronic components that incorporates a leadframe with elongate portions arranged in parallel, a heat sink, and a resin portion, where the leadframe and heat sink are embedded in the resin with gaps filled, allowing for effective heat transfer and dissipation through bumps to the heat sink exposed from the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple LEDs are mounted on the LED module to increase light output, then the light emission capability is improved, but the heat generated increases and cannot be efficiently dissipated
Solution Approach 1:
The patent transitions from conventional planar heat dissipation to three-dimensional heat dissipation by forming protrusions that extend upward from the substrate. These protrusions create vertical heat transfer paths, allowing heat to dissipate in multiple spatial dimensions rather than being confined to a single plane, thereby significantly improving heat dissipation efficiency for high-power LED modules
Solution Approach 2:
The patent applies local quality by creating concentrated protrusions at specific locations where heat generation is highest. These protrusions are strategically positioned to provide enhanced heat dissipation capacity precisely where needed, rather than uniformly distributing heat dissipation structures across the entire substrate, thus optimizing thermal management for high-density LED arrangements
2Power
If the number of LEDs is increased to meet higher lighting requirements, then the illumination output is improved, but the thermal management becomes inadequate
Solution Approach 1:
By introducing vertical protrusions that extend from the substrate surface, the patent creates additional thermal management dimensions. This three-dimensional heat dissipation architecture enables the system to handle higher illumination outputs by providing sufficient thermal pathways, thereby maintaining operational reliability even when numerous LEDs are mounted in high-density configurations
3Device complexity
If conventional heat dissipation structures are used, then the device complexity is kept simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The patent merges the substrate and heat dissipation functions into a single integrated structure. The protrusions are formed directly on the substrate, combining the mechanical support function of the substrate with the thermal management function of heat dissipation structures. This integration eliminates the need for separate heat sinks or thermal management components, maintaining structural simplicity while achieving superior heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation, maintaining the temperature of LEDs within a guaranteed operational range even when multiple LEDs are mounted, ensuring reliable performance and allowing for flexible selection of LED count to suit various applications.
Implementation Method 1
the respective gaps between the adjacent elongate portions are filled with the resin portion
Data Source
AI summary
A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively.