Thermally Conductive Insulating Sheet for Leak-Free Surface Conformity
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Solution Overview
Problem
Existing thermally conductive insulating sheets face challenges in conforming to surface irregularities of heat generating and dissipation members during heating and pressing, leading to potential material leakage and suboptimal thermal conduction performance.
Innovation Solution
A thermally conductive insulating sheet with a complex viscosity of 10,000 to 150,000 Pa·s in the temperature range of 100 to 200° C., a viscosity ratio of 1.0 to 4.0, and a flow value of 90 to 100%, ensuring appropriate fluidity and adhesion without excessive material flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the thermally conductive insulating sheet is made to flow excessively during heating and pressing, then it can conform to surface irregularities and reduce voids, but material leaks beyond the original sheet size and appearance deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the complex viscosity of the binder resin within 10,000 to 150,000 Pa·s at 100-200°C and maintaining the ratio of maximum to minimum viscosity between 1.0 to 4.0. This controlled viscosity parameter range enables the sheet to exhibit appropriate fluidity during heating and pressing - sufficient to conform to surface irregularities and reduce voids, yet restricted enough to prevent material leakage beyond the original sheet dimensions.
2Strength
If the thermally conductive insulating sheet has high fluidity during heating and pressing, then it can adhere the heat generating member to the heat dissipation member, but the thermal conduction performance may not be obtained
Solution Approach 1:
The patent resolves this contradiction through parameter changes by optimizing the complex viscosity of the binder resin to 10,000-150,000 Pa·s with a viscosity ratio (maximum/minimum) of 1.0-4.0 in the temperature range of 100-200°C. This specific viscosity range provides sufficient fluidity for the sheet to conform to surfaces and achieve strong adhesion between heat generating and dissipation members, while simultaneously maintaining structural integrity to ensure proper thermal conduction performance without excessive material flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet effectively conforms to surface irregularities, reduces voids, and prevents material leakage, resulting in improved thermal conduction and adhesion performance.
Implementation Method 1
a complex viscosity in a temperature range of 100 to 200° C. is 10,000 to 150,000 Pa·s, a ratio (α/β) of a maximum value (α) to a minimum value (β) of the complex viscosity in the temperature range is 1.0 to 4.0
Implementation Method 2
The thermally conductive insulating sheet preferably has high thermal conductivity and excellent insulating properties
Data Source
AI summary
The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (α/β) of the maximum value (α) to the minimum value (β) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.