Semiconductor Package Pressure-Contact Stacking Without Solder
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging techniques, such as multi-chip packages and Package-on-Package, result in high manufacturing costs and low yield due to the disposal of entire packages if one chip fails, hindering miniaturization and re-use of operational chips.
Innovation Solution
A semiconductor device and manufacturing method that stacks packages using a substrate with a wiring pattern and lead frames connected to semiconductor chips, allowing pressure-contact between packages without solder, which prevents warpage and enables easy re-use of functional packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging techniques (MCP/PoP) are used to stack semiconductor chips, then packaging functionality is achieved, but manufacturing cost increases and yield decreases due to disposal of entire packages when one chip fails
Solution Approach 1:
The invention divides the package into independently replaceable modules. Each semiconductor chip is mounted on a separate lead frame that can be individually detached from the substrate, allowing failed chips to be replaced without discarding the entire package. This modular segmentation enables selective maintenance and improves manufacturing yield.
Solution Approach 2:
The invention enables recovery and reuse of functional semiconductor chips by allowing individual chip replacement. When a chip fails, only that specific chip is replaced while operational chips remain in use, thereby recovering value from the package and improving overall manufacturing efficiency.
2Object-affected harmful factors
If conventional packaging with molding sections is used, then chip protection is achieved, but package thickness increases hindering miniaturization
Solution Approach 1:
The invention extracts and eliminates the molding section from the package structure. Instead of using traditional molding compound to protect chips, the lead frame itself provides structural support and protection. This extraction of the molding section significantly reduces package thickness and enables miniaturization while maintaining chip protection functionality.
Solution Approach 2:
The invention uses thin lead frame structures instead of bulky molding sections. The lead frame provides a sleek, thin protective structure that maintains chip safety while minimizing package thickness, enabling compact device design and miniaturization.
3Strength
If solder is used to fix lead frames for stacking packages, then secure connection is achieved, but warpage occurs due to temperature increase during heating
Solution Approach 1:
The invention replaces the thermal-mechanical soldering process with a pure mechanical pressure-contact system. Lead frames are connected through direct physical contact and pressure without heating, eliminating the thermal effects that cause warpage while maintaining secure mechanical connections. This substitution of connection method resolves the warpage issue.
4Reliability
If solder is used to fix semiconductor packages, then stable connection is achieved, but package re-use becomes difficult due to permanent bonding
Solution Approach 1:
The invention creates a dynamic, reversible connection system where lead frames can be pressed together to establish electrical contact and separated when needed. Unlike permanent solder bonds, the pressure-contact mechanism allows packages to be dynamically connected and disconnected, enabling re-use and reconfiguration of semiconductor components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the thickness of stacked packages, prevents warpage, and allows for the re-use of operational packages, addressing the issues of high costs and low yield in traditional packaging methods while enabling miniaturization.
Implementation Method 1
a pressure-contact section for receiving the plurality of semiconductor packages and for causing the plurality of semiconductor packages to come into contact with the wiring pattern
Data Source
AI summary
A semiconductor device in accordance with one embodiment of the invention can include a substrate onto which a wiring pattern is formed. In addition, the semiconductor device can include a plurality of semiconductor packages. Each semiconductor package can include a lead frame that is coupled to an electrode of a semiconductor chip. Each lead frame can be located on a side surface and a bottom surface of the semiconductor package. In addition, the semiconductor device can include a pressure-contact section for receiving the plurality of semiconductor packages and for causing the plurality of semiconductor packages to come into contact with the wiring pattern.