Microfeature Workpiece Adhesion Using Partially Cured Dual Adhesive System
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Solution Overview
Problem
Conventional adhesion methods for microfeature workpieces to substrates are either insufficient in strength or prone to failure due to inadequate bonding, particularly in filling surface features and withstanding shear stress.
Innovation Solution
A method involving a first adhesive on the microfeature workpiece and a second adhesive on the support member, where the second adhesive is partially cured before attaching the workpiece, forming a robust bond by combining adhesives with different compositions to stiffen the workpiece and fill surface features, while avoiding contact with the workpiece's edge surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a wafer backside laminate (WBL) is used to adhere the die to the substrate, then the strength of the die is increased, but the bond may fail due to inadequate adhesive bond because the WBL does not fill surface features on the substrate
Solution Approach 1:
The patent combines two different adhesive materials with complementary properties: a WBL layer applied to the die backside that provides die strengthening, and an epoxy adhesive applied to the substrate that flows to fill surface features. By merging these two adhesive systems, the invention achieves both die strength enhancement and reliable adhesive bonding that accommodates substrate surface variations.
Solution Approach 2:
The invention uses a composite adhesive system consisting of a WBL layer and an epoxy adhesive layer. The WBL provides structural reinforcement to the die, while the epoxy provides gap-filling and bonding capabilities. This composite approach allows each material to perform its optimal function, resolving the contradiction between die strengthening and reliable bonding.
2Reliability
If an epoxy is used to adhere the die to the substrate, then surface features on the substrate are filled, but the bond can fail in shear at the junction between the epoxy and the die, and/or at the junction between the epoxy and the substrate
Solution Approach 1:
The patent combines two different adhesive materials with complementary properties: a WBL layer applied to the die backside that provides die strengthening, and an epoxy adhesive applied to the substrate that flows to fill surface features. By merging these two adhesive systems, the invention achieves both die strength enhancement and reliable adhesive bonding that accommodates substrate surface variations.
Solution Approach 2:
The invention uses a composite adhesive system consisting of a WBL layer and an epoxy adhesive layer. The WBL provides structural reinforcement to the die, while the epoxy provides gap-filling and bonding capabilities. This composite approach allows each material to perform its optimal function, resolving the contradiction between die strengthening and reliable bonding.
3Ease of manufacture
If a single adhesive is used to adhere the die to the substrate, then the process is simplified, but the bond cannot simultaneously provide die strengthening and fill surface features effectively
Solution Approach 1:
The patent combines two different adhesive materials with complementary properties: a WBL layer applied to the die backside that provides die strengthening, and an epoxy adhesive applied to the substrate that flows to fill surface features. By merging these two adhesive systems, the invention achieves both die strength enhancement and reliable adhesive bonding that accommodates substrate surface variations.
Solution Approach 2:
The invention uses a composite adhesive system consisting of a WBL layer and an epoxy adhesive layer. The WBL provides structural reinforcement to the die, while the epoxy provides gap-filling and bonding capabilities. This composite approach allows each material to perform its optimal function, resolving the contradiction between die strengthening and reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding strength, reduces the likelihood of warping and cracking, and improves the microfeature workpiece's reliability under various environmental conditions, including moisture sensitivity testing.
Implementation Method 1
adhering the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured
Data Source
AI summary
Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.