Leadframe-BGA Package Thermal Dissipation and I/O Expansion
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Solution Overview
Problem
Integrated circuit (IC) device packages face limitations in thermal performance and input/output (I/O) capabilities due to their mechanical structure, necessitating improved solutions for effective heat dissipation and increased connectivity.
Innovation Solution
The development of integrated circuit packages that incorporate a leadframe with a die attach pad and leads, coupled with a substrate and wirebonds, allowing for enhanced thermal conductivity and increased I/O connections through a combination of ball grid array (BGA) and leadframe configurations, such as the leadframe-ball grid array (LF-BGA) package, which utilizes thermally conductive materials and multiple connection points to a printed circuit board (PCB).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional leadframe packages are used, then manufacturing cost is reduced, but thermal performance and I/O capabilities are limited
Solution Approach 1:
The patent merges the leadframe package and BGA package structures into a hybrid LF-BGA package. The leadframe provides mechanical support and thermal conduction paths, while the BGA substrate provides multiple I/O connection points. This combination resolves the contradiction by achieving improved thermal performance and I/O capabilities without completely abandoning the simpler leadframe structure.
Solution Approach 2:
The leadframe in the hybrid package serves multiple functions: it provides mechanical support for the IC die, acts as a thermal conduction path to dissipate heat, and offers electrical connection points through its leads. The substrate simultaneously provides I/O connections and additional thermal management. This multi-functionality resolves the contradiction by making each component do more work, improving overall performance without proportionally increasing complexity.
2Adaptability or versatility
If traditional leadframe packages are used, then device complexity is reduced, but I/O capabilities are limited
Solution Approach 1:
The patent transitions from the traditional two-dimensional peripheral connection structure of leadframe packages to a three-dimensional BGA-style array of connection points on the substrate. This dimensional change allows numerous I/O connections to be made within the same package footprint, dramatically increasing I/O capabilities without proportionally increasing the package size or complexity.
3Temperature
If hybrid LF-BGA package structure is implemented, then thermal performance is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates thermal conduction paths and thermal vias during the substrate manufacturing process itself, before the IC die is mounted. This preliminary action ensures thermal management capabilities are built into the package structure from the outset, rather than requiring additional post-assembly thermal management components or processes, thereby reducing overall manufacturing complexity despite the hybrid structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances thermal performance and I/O capabilities, providing better heat dissipation and increased connectivity while maintaining cost-effectiveness compared to traditional packages, with improved signal quality and power stability.
Implementation Method 1
The leadframe includes a die attach pad having opposing first and second surfaces and a plurality of leads that emanate in an outward direction from the die attach pad. The IC die is coupled to the first surface of the die attach pad.
Data Source
AI summary
Methods and apparatus for integrated circuit (IC) packages with improved thermal performance and input/output capabilities are described. An integrated circuit (IC) package includes a leadframe, an IC die, a substrate having opposing first and second surfaces, a first wirebond, and a second wirebond. The leadframe includes a die attach pad having opposing first and second surfaces and a plurality of leads that emanate in an outward direction from the die attach pad. The IC die is coupled to the first surface of the die attach pad. The substrate is coupled to the die attach pad. Contact pads on the first surface of the substrate are electrically connected to bond fingers on the second surface of the substrate. The first wirebond couples a first bond pad on a first surface of the IC die to a bond finger on the second surface of the substrate. The second wirebond couples a second bond pad on the first surface of the IC die to a lead of the plurality of leads.