Semiconductor Pad Pattern Insulating Polymer Layer NCF Intrusion Prevention
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Solution Overview
Problem
Reliability failures in semiconductor devices occur due to non-conductive film (NCF) intrusion between pad patterns and conductive bumps during chip assembly, leading to electrical connectivity issues.
Innovation Solution
A semiconductor device design featuring a protective layer, redistribution pattern, pad pattern, and insulating polymer layer, where the pad pattern has a flat upper surface and the insulating polymer layer covers the redistribution pattern and pad pattern's sidewall, preventing NCF intrusion and ensuring a flat interface between the pad pattern and conductive bump.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If non-conductive film (NCF) is used to bond upper and lower chips, then chip assembly is enabled, but NCF may intrude between pad patterns and conductive bumps causing reliability failures
Solution Approach 1:
The patent introduces an insulating polymer layer as an intermediary substance between the pad pattern and the conductive bump. This layer fills the gap and prevents NCF intrusion while maintaining electrical connectivity through the conductive bump, thus resolving the contradiction between enabling chip assembly and ensuring reliability
Solution Approach 2:
The insulating polymer layer is applied in advance before the bonding process. By pre-filling the gap between the pad pattern and conductive bump, the NCF is prevented from intruding during the bonding process, thus ensuring reliable electrical connectivity while enabling chip assembly
2Ease of manufacture
If pad pattern has non-flat upper surface, then manufacturing is easier, but NCF may intrude into irregular spaces causing reliability issues
Solution Approach 1:
The insulating polymer layer is applied in advance to fill any irregularities and create a flat interface on the pad pattern's upper surface. This preliminary flattening action prevents NCF intrusion into irregular spaces while maintaining the ease of pad pattern formation
Solution Approach 2:
The insulating polymer layer is selectively applied to the upper surface region to create a flat interface, while other regions of the pad pattern can maintain their original formation characteristics. This local flattening prevents NCF intrusion without requiring complete redesign of the pad pattern formation process
Data Source
AI summary
A semiconductor device includes a protective layer, a redistribution pattern, a pad pattern and an insulating polymer layer. The protective layer may be formed on a substrate. The redistribution pattern may be formed on the protective layer. An upper surface of the redistribution may be substantially flat. The pad pattern may be formed directly on the redistribution pattern. An upper surface of the pad pattern may be substantially flat. The insulating polymer layer may be formed on the redistribution pattern and the pad pattern. An upper surface of the insulating polymer layer may be lower than the upper surface of the pad pattern.