Transformer Magnetic Features Enhance Coupling Efficiency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional transformer structures in semiconductor integrated circuits face challenges with reduced mutual inductive coefficient and self-resonant frequency as device sizes decrease, leading to decreased coupling efficiency with advancing technology nodes.
Innovation Solution
A semiconductor device structure and method that incorporates a transformer with magnetic features, such as nickel or nickel nitride, strategically placed between inductors to enhance inductive coupling, using techniques like physical vapor deposition or plating, and configured to optimize mutual inductance and coupling coefficient.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If device size is decreased to advance technology nodes, then functional density increases, but coupling efficiency and mutual inductive coefficient decrease
Solution Approach 1:
A magnetic feature layer is introduced as an intermediary between the first and second inductor patterns. This magnetic layer, containing nickel or nickel nitride, acts as a mediator to enhance magnetic coupling between the inductors, thereby maintaining coupling efficiency despite the reduced device size and increased functional density.
Solution Approach 2:
The transformer structure employs composite materials by combining conventional inductor patterns with a magnetic feature layer containing nickel or nickel nitride. This composite structure leverages the magnetic properties of nickel to enhance mutual inductance and coupling coefficient, resolving the degradation that occurs with miniaturization.
2Area of moving object
If device size is decreased, then integration density improves, but self-resonant frequency decreases
Solution Approach 1:
The magnetic feature layer serves as an intermediary that concentrates and directs magnetic flux between the inductors. This mediation effect enhances the mutual inductive coupling, thereby maintaining self-resonant frequency despite the reduced device area and improved integration density.
3Ease of manufacture
If traditional transformer structures are used, then manufacturing simplicity is maintained, but coupling coefficient degrades with scaling
Solution Approach 1:
The invention changes the magnetic parameter of the transformer structure by introducing a magnetic feature layer with high permeability (nickel or nickel nitride). This parameter change enhances the coupling coefficient without fundamentally altering the manufacturing process, as the magnetic layer can be deposited using existing PVD or plating techniques.
Solution Approach 2:
By creating a composite structure that combines conventional inductor patterns with a magnetic feature layer, the invention maintains manufacturing simplicity while significantly improving coupling coefficient. The magnetic layer is integrated using standard semiconductor fabrication processes such as physical vapor deposition or electroplating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances inductive coupling and mutual inductance, improving the transformer's performance by maintaining or increasing coupling efficiency even at smaller device sizes, thus addressing the limitations of traditional transformer structures.
Implementation Method 1
a magnetic feature that is disposed approximate the first and second inductors and is configured to enhance inductive coupling between the first and second inductors
Implementation Method 2
such as nickel or nickel nitride, strategically placed between inductors to enhance inductive coupling
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes a first inductor formed on a first substrate; a second inductor formed on a second substrate and conductively coupled with the first inductor as a transformer; and a plurality of micro-bump features configured between the first and second substrates. The plurality of micro-bump features include a magnetic material having a relative permeability substantially greater than one and are configured to enhance coupling between the first and second inductors.