Semiconductor Module Frame for Screw Fixing Without Resin Warpage
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Solution Overview
Problem
Conventional methods of directly fixing semiconductor modules to supports using screws can lead to warpage, deformation, and heat radiation performance issues, resulting in defects, malfunctions, and increased costs due to the need for screw insertion holes or cuts.
Innovation Solution
A semiconductor device design featuring a support, a semiconductor module with a resin member, and a heat transfer medium, where a first frame member with a frame portion covering the edge of the resin member is fixed to the support, allowing screws to be inserted through the frame member to secure the module without direct screw insertion into the resin member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are inserted directly into the resin member to fix the semiconductor module to the support, then the fixing strength is improved, but the resin member undergoes warpage and deformation
Solution Approach 1:
A frame member is introduced as an intermediary component between the semiconductor module and the support. The frame member has a frame portion that covers the edge portion of the resin member and fastening portions with insertion holes for screws. The screws are inserted into the frame member, not directly into the resin member, thereby distributing the fixing stress and preventing warpage and deformation of the resin member while maintaining strong fixation.
2Ease of manufacture
If the semiconductor module is fixed obliquely to the support, then the assembly process becomes simpler, but the heat radiation performance deteriorates
Solution Approach 1:
The frame member is designed with a structure that preliminarily establishes proper alignment and positioning. The frame portion covers the edge portion of the resin member and provides a stable base, while the fastening portions are positioned to ensure that when screws are inserted, the semiconductor module is fixed perpendicular to the support, not obliquely. This preliminary structural arrangement prevents oblique fixation and ensures proper heat radiation performance.
3Ease of manufacture
If screw insertion holes are formed in the resin member, then the fixing process is simplified, but manufacturing costs increase due to additional processing
Solution Approach 1:
The fixing structure is segmented into separate functional components: the resin member that seals the semiconductor chip, and the frame member that provides the fastening function. The frame member has the insertion holes for screws, not the resin member. This segmentation allows the resin member to maintain its integrity without additional hole-drilling processing, while the frame member serves as the dedicated fastening component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces stress and deformation, prevents oblique fixation and heat radiation performance deterioration, and lowers manufacturing costs by eliminating the need for screw insertion holes, while enhancing the fixing strength and maintaining high-quality performance.
Implementation Method 1
a heat transfer medium disposed between the support and the semiconductor module
Data Source
AI summary
A semiconductor device includes a support, a semiconductor module, a heat transfer medium, and a first frame member. The semiconductor module includes a semiconductor chip and a resin member sealing the semiconductor chip, and is mounted on the support via the heat transfer medium. The first frame member is disposed on the semiconductor module. The first frame member has a first frame portion that covers an edge portion of an upper surface of the semiconductor module, and a first opening portion formed in the first frame portion for exposing the semiconductor module. The first frame member is fixed to the support by screws.