Embedded Electronic Module Adhesion Layer for High-Voltage Reliability
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Solution Overview
Problem
Current chip embedding processes fail to meet high voltage application requirements due to limited breakdown voltage, ion impurity levels, and reliability issues with existing PCB materials, particularly for voltages above 650V, and problems with adhesion and delamination of polymer layers.
Innovation Solution
An electronic device module is fabricated using a core layer with an opening, an electronic device placed within, and both covered by an adhesion promoter layer, which is then embedded with an encapsulant layer to enhance adhesion and reliability, employing materials like Al2O3 and AlOOH for the adhesion promoter layers and FR materials for the core layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current PCB materials and chip embedding processes are used, then manufacturing simplicity is maintained, but reliability and breakdown voltage are limited to 650V or below
Solution Approach 1:
The patent applies preliminary action by depositing the adhesion promoter layer on the core layer and electronic device surfaces before the embedding process. This pre-treatment ensures that the encapsulant layer will properly adhere to these surfaces, preventing delamination under high voltage stress while maintaining a systematic manufacturing approach
Solution Approach 2:
The adhesion promoter layer acts as an intermediary between the encapsulant layer and the surfaces it contacts (core layer and electronic device). This intermediate layer improves interfacial adhesion and prevents delamination, enabling reliable high voltage operation without requiring fundamentally new manufacturing processes
2Reliability
If polymer layers like prepreg layers are used for chip embedding, then ease of manufacture is improved, but adhesion is limited and local delamination occurs
Solution Approach 1:
The adhesion promoter layer serves as a mediator between the polymer encapsulant layer and the surfaces it bonds to. This intermediate layer chemically or physically enhances the bonding interface, preventing delamination that would otherwise occur with standard polymer layers, while still using conventional manufacturing materials and processes
Solution Approach 2:
The patent changes the surface properties of the core layer and electronic device by depositing the adhesion promoter layer. This modifies surface energy, roughness, or chemical composition parameters to improve wetting and adhesion of the encapsulant layer, enabling reliable bonding without changing the bulk properties of the materials
3Reliability
If standard PCB materials are used for chip embedding, then ease of manufacture is maintained, but ion impurity levels and overall reliability are limited
Solution Approach 1:
The patent extracts or removes the problem of ion impurities by introducing the adhesion promoter layer as a separate functional component. This layer acts as a barrier or filter that prevents ion migration between the encapsulant and device surfaces, isolating the ion impurity issue to a specific interface that can be controlled independently of the bulk PCB materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the reliability and adhesion of the electronic device module, enabling it to handle higher voltages and reducing the risk of delamination, thus addressing the limitations of current chip embedding processes.
Implementation Method 1
one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer
Data Source
Figure 1~3
Figure 4A~4C
Figure 4D~4F
AI summary
An electronic device module (10) comprising a core layer (1) comprising an opening (1A), an electronic device (2) disposed in the opening (1A), one or both of the core layer (1) and the electronic device (2) being at least partially covered by an adhesion promoter layer (3), and an encapsulant layer (4) at least partially embedding the core layer (1) and the electronic device (2).