Semiconductor Chip Package Fabrication via Layered Interconnect Redesign

The patent divides the interconnection structure into multiple functional layers: a base layer for mechanical support, a first layer (dielectric layer) for insulation, a second layer (conductive layer) for electrical connection, and a third layer (dielectric layer) for protection. This segmentation allows each layer to perform its specific function optimally, ensuring reliable electrical connections while maintaining manageable complexity through clear functional separation.

The patent employs composite material structures combining different dielectric materials and conductive materials in layered configurations. The use of composite materials with complementary properties (insulation, conductivity, mechanical strength) enables reliable electrical connections between contact pads and external contact elements while the layered composite structure provides both electrical functionality and mechanical stability.

The patent applies preliminary actions by pre-forming the base layer with embedded contact elements, then sequentially adding the dielectric and conductive layers in a controlled manufacturing sequence. This preliminary preparation of the base layer simplifies subsequent manufacturing steps, as the electrical connection path is pre-established and subsequent layers only need to be deposited and patterned accordingly.

The patent transitions from planar two-dimensional connections to three-dimensional stacked layer connections. By adding the vertical dimension with multiple layers (base layer, first dielectric layer, conductive layer, second dielectric layer), the patent enables electrical connections that route signals through the thickness of the package, allowing more flexible routing and connection schemes that can be manufactured using standard layered deposition and patterning techniques.

The patent applies the multi-functionality principle by designing the second layer (conductive layer) to simultaneously serve as both an electrical interconnect layer and an adhesion layer. This conductive layer provides electrical pathways for signal transmission while also providing mechanical adhesion between the dielectric layers and embedded structures. This dual functionality reduces the total number of layers needed and simplifies the overall structure.

The patent employs composite material design for the second layer, using conductive materials with inherent adhesion properties or applying adhesion-promoting coatings on the conductive layer. This composite approach ensures that the single layer can fulfill both electrical and mechanical functions, though it does require precise control of material properties and deposition parameters to achieve both interconnect and adhesion functions simultaneously.