Nested Heat Dissipation Plates for Semiconductor Cooling
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Solution Overview
Problem
Conventional cooling apparatuses for switching semiconductor devices face limitations in heat dissipation performance due to increased thermal resistance and require larger sizes and structural changes, leading to increased costs and installation restrictions.
Innovation Solution
A cooling apparatus comprising a first heat dissipation plate coupled to the semiconductor device and a second heat dissipation plate inserted inside the installation space, allowing for enhanced heat exchange without increasing the installation space or fluid flow path size, and optionally including a third heat dissipation plate for further area expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a flat plate type fin structure (heat dissipation plate) is attached to cool down the switching semiconductor device, then the device can be cooled, but heat dissipation performance is limited due to increased thermal resistance
Solution Approach 1:
The patent applies nesting by placing the second heat dissipation plate inside the installation space of the first heat dissipation plate. The second plate is positioned within the thickness direction space of the first plate, creating a nested configuration that increases heat dissipation area without expanding the overall installation footprint, thereby resolving the contradiction between cooling performance and thermal resistance.
Solution Approach 2:
The patent transitions from a single-plane heat dissipation approach to a multi-dimensional configuration by adding the second heat dissipation plate in the thickness direction. This dimensional change allows heat to be dissipated through multiple surfaces and paths, reducing thermal resistance while maintaining the same installation space boundaries.
2Temperature
If sizes (volumes) of the heat dissipation plate and cooling flow path are increased to increase cooling performance, then cooling performance improves, but installation is restricted
Solution Approach 1:
The second heat dissipation plate is nested within the installation space defined by the first heat dissipation plate's footprint. This nesting allows the system to increase cooling performance through additional heat dissipation surfaces without increasing the overall installation area, as the second plate utilizes the vertical space already allocated.
Solution Approach 2:
The solution moves from horizontal expansion to vertical utilization by placing the second heat dissipation plate in the thickness direction. This dimensional shift enables increased cooling performance while maintaining the same installation space boundaries, as the additional plate occupies vertical rather than horizontal space.
3Temperature
If sizes (volumes) of the heat dissipation plate and cooling flow path are increased to increase cooling performance, then cooling performance improves, but additional costs are incurred due to changes in size and structure
Solution Approach 1:
The heat dissipation system is segmented into multiple independent plates (first and second heat dissipation plates) that can be manufactured separately using standard processes. This segmentation allows each plate to be produced with conventional manufacturing techniques without requiring costly custom tooling or process changes, thereby improving cooling performance while controlling manufacturing costs.
4Area of stationary object
If a compact configuration is desired to reduce installation space, then space is reduced, but heat dissipation area is limited
Solution Approach 1:
The nested configuration of the second heat dissipation plate within the first plate's installation space allows the system to maintain a compact footprint while increasing the effective heat dissipation area. The second plate utilizes the vertical space within the same horizontal boundaries, achieving both compactness and enhanced heat dissipation.
Solution Approach 2:
The solution addresses the contradiction by exploiting the thickness direction dimension. The second heat dissipation plate is positioned in the vertical space, allowing the system to increase heat dissipation area without expanding the horizontal installation footprint, thus achieving compact configuration with enhanced heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases heat dissipation area and cooling performance without expanding the installation space or altering the fluid flow path structure, reducing costs and maintaining compact configurations while improving heat exchange efficiency.
Implementation Method 1
a first heat dissipation plate configured to facilitate heat dissipation of a surface of the semiconductor device at an installation space... a second heat dissipation plate disposed inside the installation space... configured to contact the first heat dissipation plate so as to allow heat exchange
Data Source
AI summary
The present disclosure relates to a switching semiconductor device and a cooling apparatus thereof. The cooling apparatus of the switching semiconductor device of the present disclosure comprises a first heat dissipation plate configured to facilitate heat dissipation of a surface of the semiconductor device at an installation space, and a second heat dissipation plate disposed inside the installation space along a thickness direction of the first heat dissipation plate. The installation space is formed in a predetermined size at the surface of the semiconductor device, and the second heat dissipation plate is configured to contact the first heat dissipation plate so as to allow heat exchange. Accordingly, a heat dissipation area may be increased without increasing a size of the installation space.