Non-uniform wire routing via variable mandrel pitch SADP

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Solution Overview

Problem

Conventional self-aligned double patterning (SADP) processes result in uniform wire spacing, which is undesirable for varying wire spacing requirements to reduce same-metal cross-capacitance and improve signal performance.

Innovation Solution

The method involves forming mandrels with varying pitches within the SADP range, where some mandrels are spaced closer than others, allowing spacers to either form gaps or extend continuously, enabling non-uniform trench formation and metal routing pitches that can vary between regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional SADP process is used to form wire routing, then pitch smaller than TMP can be achieved, but wire spacing becomes uniform which increases same-metal cross-capacitance

Engineering Contradiction:
Improvewire pitchVSAvoidsame-metal cross-capacitance
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by forming different spacer configurations in different regions: in first regions, spacers have gaps exposing the first work surface to create larger wire spacing, while in second regions, spacers extend continuously to create smaller wire spacing. This allows different wire pitches in different locations, reducing cross-capacitance for critical signals while maintaining dense routing for non-critical signals.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The wire routing is segmented into different regions with different spacing characteristics. The first work surface is divided into first regions and second regions, with each region having different spacer configurations (gapped vs. continuous), enabling differentiated wire spacing to optimize for different signal types.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If uniform wire spacing is used to simplify manufacturing, then process complexity is reduced, but signal performance deteriorates due to increased cross-capacitance

Engineering Contradiction:
Improveprocess complexityVSAvoidsignal performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses local quality to apply different spacer configurations in different regions based on signal requirements. Critical signals (clock, high-fanout, speed-critical) receive larger spacing through gapped spacers, while non-critical signals maintain smaller spacing with continuous spacers, optimizing signal performance without excessive complexity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The spacer configuration is made dynamic by allowing gaps to form in certain regions while remaining continuous in others, based on the underlying mandrel pattern. This dynamic approach enables the routing to adapt to different signal requirements while using a uniform spacer formation process.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS9099531B1Metal routing in advanced process technologies
Publication Date: 2015.08.04 ALTERA CORP
  • US9099531B1 patent drawing
  • US9099531B1 patent drawing
  • US9099531B1 patent drawing

AI summary

A plurality of elongated, substantially parallel mandrels are formed on a first work surface, the mandrels being spaced apart a distance in the range between the resolution limit and twice the resolution limit. Spacers are formed on the work surface extending from sidewalls of the mandrels. First portions of the work surface are exposed through gaps in the spacers near the midpoint between a majority of adjacent mandrels; but at least one pair of adjacent mandrels is close enough together that the spacers extend continuously between the adjacent mandrels. The mandrels are then removed, thereby exposing second portions of the work surface. The exposed first and second portions are etched down to a second work surface; and the exposed portions of the second work surface are etched to form trenches in that surface. A wire routing is formed by filling the trenches with a metal such as copper.