Foldable Substrate Electronic Component Wiring Length Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In stacked-type electronic components, the long wiring paths due to foldable substrates lead to decreased transmission speed, increased electrical resistance, and heat generation, while the limited surface area at the lower portion restricts the number of devices that can be stacked, and the complex connection of multiple devices in a multi-layer arrangement requires significant time and labor.
Innovation Solution
The use of a configuration where multiple first substrates are connected in series along a coupling path and a second substrate is connected perpendicularly to form a foldable structure, allowing the substrates to be stacked and folded to reduce wiring length, increase mounting efficiency, and simplify manufacturing by dividing wiring routes and reducing the number of wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a foldable substrate is used to stack multiple electronic devices, then the mounting area is reduced and space-saving effect is achieved, but the wiring path length increases leading to decreased transmission speed and increased electrical resistance
Solution Approach 1:
The patent transitions from planar substrate layout to three-dimensional folded structure, allowing electronic devices to be stacked vertically while maintaining compact footprint. The substrate is folded along predetermined lines to create multiple layers, effectively utilizing the third dimension (height) to accommodate more devices without increasing the mounting area.
Solution Approach 2:
The substrate is divided into multiple segments or sections that can be folded independently. By segmenting the substrate into foldable sections, the patent creates multiple wiring paths that are shorter than the original planar path, as signals can travel vertically through the folded structure rather than across the entire substrate surface.
2Quantity of substance
If the substrate surface area is increased to accommodate more devices at the lower portion, then the number of stackable devices increases, but the mounting area of the stacked-type electronic component increases
Solution Approach 1:
The patent uses vertical stacking through substrate folding to increase device capacity without expanding the horizontal mounting area. Multiple electronic devices are arranged in layers along the vertical dimension, allowing higher device density within the same footprint.
Solution Approach 2:
The folded substrate structure creates nested layers where electronic devices are stacked one above another. Each layer contains devices that are vertically positioned, similar to nested dolls, maximizing the use of vertical space to accommodate more devices without increasing the overall mounting area.
3Speed
If multiple electronic devices are arranged in multi-layer manner without foldable substrate, then the wiring path length is reduced, but the manufacturing complexity and labor increase due to numerous connection terminals
Solution Approach 1:
The patent merges multiple wiring paths into the folded substrate structure itself. The substrate acts as both the mechanical support and the wiring carrier, combining the functions of structural element and electrical interconnection. This integration reduces the number of separate connection terminals needed compared to discrete multi-layer arrangements.
Solution Approach 2:
The substrate is pre-folded along predetermined lines before device mounting, creating the three-dimensional stacked structure in advance. This preliminary folding action establishes the vertical arrangement and wiring paths beforehand, simplifying subsequent device attachment and reducing manufacturing complexity compared to assembling multiple layers from scratch.
Data Source
AI summary
An electronic component includes: a plurality of first substrates that are connected in series along a coupling path; and a second substrate that is connected with one first substrate of the plurality of first substrates. The second substrate is in line with the one first substrate along a connection direction intersecting the coupling path, and the plurality of first substrates and the second substrate are configured to be foldable such that they are stacked.