Spacer Dies for Reusable IC Package Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Custom-made integrated circuit (IC) packages that house multiple transceiver ICs are often over-built and not scalable or reusable, leading to increased costs, development time, and delayed release dates due to the need for redesigning packages for varying numbers of transceiver ICs, as unused ICs consume leakage power and require additional engineering effort.
Innovation Solution
Incorporating spacer dies, which are dummy dies without active or passive circuitry, to replace unused transceiver ICs in IC packages, allowing a single design to be reused for different applications, reducing development time and costs by eliminating the need for custom-made packages and minimizing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If custom-made IC packages are designed for each application with varying numbers of transceiver ICs, then the packages can be optimized for specific applications, but the development time and costs increase due to redesign requirements
Solution Approach 1:
The patent implements a universal IC package design that can accommodate varying numbers of transceiver ICs through the use of spacer dies. The package is designed with multiple possible locations for transceiver ICs, and spacer dies are used to fill unused locations, allowing the same package design to serve multiple applications with different configurations of active ICs.
Solution Approach 2:
The patent uses spacer dies as dummy copies that replicate the physical presence and footprint of unused transceiver IC locations without containing active circuitry. These spacer dies are essentially simplified copies of the actual transceiver IC packages, providing the necessary mechanical and electrical interface structure without the functional complexity, thereby enabling reuse of the package design.
2Adaptability or versatility
If custom-made IC packages are designed for each application, then specific application requirements are met, but manufacturing costs increase due to lack of reusability
Solution Approach 1:
The patent creates a universal package platform that can be manufactured once and reused across multiple applications by simply changing which IC locations are populated with active transceiver ICs and which are filled with spacer dies. This dramatically reduces per-unit manufacturing costs while maintaining the ability to meet specific application requirements through selective IC placement.
Solution Approach 2:
The patent employs spacer dies as inexpensive placeholder components that can be easily manufactured and integrated. These spacer dies serve as low-cost substitutes for unused IC locations, eliminating the need to manufacture custom packages for each application while still providing the necessary structural and electrical interface functions.
3Adaptability or versatility
If all transceiver IC locations are populated in IC packages, then the package design is complete and reusable, but unused ICs consume leakage power
Solution Approach 1:
The patent extracts the problematic unused transceiver ICs from the package configuration by replacing them with spacer dies that have no active circuitry. This removal of unnecessary active components eliminates their leakage power consumption while preserving the physical package structure and enabling design reusability across multiple applications.
Solution Approach 2:
The patent converts the harmful effect of unused ICs consuming leakage power into a beneficial solution by using spacer dies. The spacer dies serve as placeholders that maintain the package's structural integrity and electrical interfaces while completely eliminating the power consumption issue associated with unused active ICs.
Data Source
AI summary
An integrated circuit package includes a first integrated circuit die, a spacer die coupled in the integrated circuit package in a location designed to house a second integrated circuit die, and a package substrate coupled to the first integrated circuit die and to the spacer die.