Glass Interposer Module with Light Transmissive Member for Thermal Distortion Control
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Solution Overview
Problem
In camera modules, the difference in linear expansion coefficients between glass substrates and silicon-based sensors causes warpage and distortion, leading to erroneous gyro signals and the inability to correct camera shake, and existing solutions fail to achieve height reduction due to exposed light receiving surfaces.
Innovation Solution
A glass interposer module with an image sensor and a light transmissive member between the image sensor and the glass interposer, where the glass interposer has a linear expansion coefficient matching silicon, enhancing rigidity and reducing distortion, and includes features like through glass vias, light absorbing films, and flexible printed circuits to support sensors and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass substrate is used to protect the light receiving surface and reduce thermal stress, then the structural strength and thermal stress resistance are improved, but warpage and distortion occur due to the difference in linear expansion coefficient between the glass substrate and silicon-based sensors
Solution Approach 1:
The patent changes the material parameter (linear expansion coefficient) of the glass substrate to match that of the silicon-based sensor. By selecting glass with a linear expansion coefficient of 0.7 to 6×10−6(K−1), which is substantially equal to that of silicon, the patent eliminates warpage and distortion that occur during temperature changes while maintaining the protective function of the glass substrate.
2Reliability
If the light receiving surface is exposed without contacting the glass substrate, then the light receiving performance is improved, but a separate protective glass substrate is needed and height reduction cannot be achieved
Solution Approach 1:
The patent merges the protective glass substrate function with the light receiving surface by having the light receiving surface of the image sensor directly contact the inner surface of the glass substrate. This integration eliminates the need for a separate protective layer and reduces the overall module height while maintaining both protection and light receiving performance.
3Adaptability or versatility
If a gyro sensor is mounted on the glass substrate, then the camera shake correction function is added, but distortion in the gyro sensor occurs due to the difference in linear expansion coefficient, generating erroneous gyro signals
Solution Approach 1:
The patent changes the linear expansion coefficient parameter of the glass substrate to match that of silicon-based gyro sensors. By using glass with a linear expansion coefficient of 0.7 to 6×10−6(K−1), the patent prevents distortion of the gyro sensor during temperature changes, ensuring accurate gyro signals and enabling reliable camera shake correction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces distortion and achieves height reduction by matching the linear expansion coefficient of the glass interposer with silicon, ensuring accurate gyro signals and improved camera module rigidity, while maintaining flatness and reducing external deformation.
Implementation Method 1
a light transmissive member charged between the light receiving surface of the image sensor and the glass interposer
Implementation Method 2
the glass interposer has a linear expansion coefficient matching silicon, enhancing rigidity and reducing distortion
Data Source
AI summary
The present disclosure relates to a glass interposer module, an imaging device, and an electronic apparatus capable of reducing occurrence of distortion caused by thermal expansion during manufacture. A light transmissive member is charged between a glass interposer and a CMOS image sensor (CIS). Since rigidity of the glass interposer can be enhanced by this configuration, it is possible to suppress deflection of the CIS and also reduce influence of distortion given to a gyro sensor and the like which are equipped on the glass interposer, and therefore, erroneous detection of a gyro signal can be reduced. The present disclosure can be applied to a glass interposer module.