Phase Change Material Thermal Management in Stacked Silicon Packages
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Solution Overview
Problem
Conventional chip package assemblies face challenges in thermal management, particularly in high-power applications where traditional polymeric thermal interface materials fail to effectively dissipate heat, leading to increased thermal junction temperatures and potential device failure.
Innovation Solution
Incorporating a phase change material within the chip package assembly between the IC die and the cover, which creates a robust heat transfer path and allows for efficient heat removal, thereby mitigating thermal coupling and temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional polymeric thermal interface materials are used, then the chip package assembly can be manufactured with conventional materials, but the thermal conductivity is limited and heat dissipation is insufficient
Solution Approach 1:
The patent changes the thermal conductivity parameter of the interface material by replacing conventional polymeric materials with phase change materials that have superior thermal properties. The phase change material undergoes a transition from solid to liquid state at operating temperatures, creating a conformal interface that maximizes thermal contact between the IC die and heat sink, thereby significantly improving heat dissipation and reducing thermal junction temperatures.
Solution Approach 2:
The patent utilizes the phase transition property of the phase change material, which transitions from solid to liquid at temperatures between 30°C and 100°C. This phase change allows the material to flow and conform to the microscopic irregularities of the IC die and heat sink surfaces, eliminating air gaps and creating an optimal thermal interface that dramatically enhances heat transfer efficiency compared to conventional polymeric materials.
2Power
If indirect cooling techniques such as chillers are used, then high power dissipation requirements can be handled, but heat transfer to the exterior of the chip package assembly remains limited
Solution Approach 1:
The patent introduces a phase change material as an intermediary substance between the IC die and the heat sink. This intermediary material undergoes phase transition to create a conformal thermal interface that dramatically improves heat transfer from the high-power IC die to the external cooling system, overcoming the limitation of heat transfer bottlenecks in conventional indirect cooling arrangements.
3Ease of manufacture
If conventional chip packaging schemes are used, then manufacturing processes are well-established, but thermal management becomes increasingly challenging with higher component density
Solution Approach 1:
The patent employs composite material strategies by combining the phase change material with existing chip packaging structures. The phase change material is integrated into the conventional packaging scheme, maintaining compatibility with established manufacturing processes while introducing superior thermal management capabilities through the unique phase transition properties of the material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of phase change material enhances thermal management by providing a rapid and efficient heat transfer path, enabling the reliable operation of high-powered IC dies and extending the service life of electronic devices.
Implementation Method 1
phase change material disposed between the IC die and a cover of the chip package assembly
Implementation Method 2
phase change material provides a rapid and efficient heat transfer path
Implementation Method 3
phase change material provides a rapid and efficient heat transfer path vertically away from the IC die to the cover
Data Source
AI summary
A chip package assembly and method for fabricating the same are provided which incorporate phase change materials within the chip package assembly for improved thermal management. In one example, a chip package assembly is provided that includes a substrate, a first integrated circuit (IC) die stacked on the substrate, a dielectric filler layer, a cover and a phase change material. The phase change material is sealed within a recess formed between the first IC dies and the cover.