Packaging Substrate Wire Removal for Defect Rework and Reuse
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Solution Overview
Problem
Existing methods for removing defective electrical wires from packaging substrates in electronic device fabrication are inefficient, leading to increased waste and manufacturing costs, as they often damage the substrates and components, preventing reuse.
Innovation Solution
An automated wire cutting apparatus is used to selectively detach and remove defective wires based on predetermined instructions, which can be pattern-based, using a wire cutting instrument to apply a shear force and a shaker to remove detached wires without damaging the substrate or other components, allowing for the reuse of packaging substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual wire removal methods are used, then defective wires can be removed from packaging substrates, but the substrates and components are damaged, preventing reuse
Solution Approach 1:
The patent replaces manual mechanical wire removal with an automated wire cutting apparatus that uses precisely controlled cutting instruments. This substitution eliminates the uncontrolled mechanical forces that cause damage to substrates and components, while maintaining the ability to remove defective wires effectively.
Solution Approach 2:
The patent implements precise control over cutting parameters including position, depth, angle, and force applied by the wire cutting instrument. By optimizing these parameters, the system can remove defective wires while preventing damage to the substrate and other components, thereby enabling substrate reuse.
2Productivity
If automated wire cutting apparatus is used, then wire removal efficiency is improved, but device complexity increases
Solution Approach 1:
The wire cutting apparatus is designed with multi-functional capabilities including automated positioning, pattern recognition, selective wire identification, and cutting operations. By consolidating these functions into a single integrated system, the patent achieves high wire removal efficiency while managing device complexity through functional integration rather than multiple separate devices.
Solution Approach 2:
The apparatus incorporates automated positioning and pattern recognition capabilities that allow the system to identify and remove defective wires autonomously without requiring complex manual intervention or multiple specialized devices. This self-service approach improves productivity while keeping the overall system complexity manageable.
3Adaptability or versatility
If selective wire removal based on pattern recognition is implemented, then substrate reuse is enabled, but manufacturing process complexity increases
Solution Approach 1:
The system performs preliminary pattern recognition and identification of defective wires before the cutting operation. By pre-positioning the wire cutting instrument and determining the cutting path based on detected wire patterns, the system enables selective wire removal while managing process complexity through advance planning and automated sequencing.
Solution Approach 2:
The apparatus incorporates feedback mechanisms where the position and status of wires are detected and used to control the cutting operation. This feedback loop enables adaptive selective wire removal based on actual wire patterns, improving versatility while managing complexity through automated control rather than complex manual procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the efficient and cost-effective reuse of packaging substrates by removing defective wires without damaging the substrates or components, reducing waste and improving manufacturing efficiency.
Implementation Method 1
moving one or both of a wire cutting instrument of the wire cutting apparatus and the packaging substrate relative to the other to contact the defective wire to effect separation of the defective wire from the packaging substrate
Implementation Method 2
removing the detached defective wire can include shaking the packaging substrate
Data Source
AI summary
Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include providing a packaging substrate including a die mounted on the packaging substrate and a plurality of defective wires coupled to the packaging substrate. The method can include executing in response to a trigger, by an automated wire cutting apparatus without user input, a set of stored instructions to position a wire cutting instrument of the automated wire cutting apparatus and a first defective wire of the plurality of defective wires adjacent to one another, and sequentially detach the plurality of defective wires from the packaging substrate using the wire cutting instrument.