Semiconductor Package with Exposed Thermal Clip for Heat Dissipation
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Solution Overview
Problem
Semiconductor devices face challenges in heat dissipation and versatility in attachment to printed circuit boards, particularly in consumer electronics where smaller form factors require improved thermal management and adaptable mounting capabilities to accommodate varying die sizes or multiple dies with the same footprint.
Innovation Solution
A packaged semiconductor device design featuring a semiconductor die with exposed thermal clips and pads, encapsulated in nonconductive molding material, allowing for natural heat dissipation and reversible mounting to PCBs, enabling different die sizes or multiple dies to share the same footprint, with pre-plated lead frames simplifying manufacturing and accommodating copper bumping and electroless nickel gold bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal clips are attached to semiconductor dies to act as heat sink, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines the thermal clip structure with the lead frame assembly, integrating heat dissipation functionality into the existing package structure. The thermal clip is formed as part of the lead frame component that also provides electrical connection, merging thermal management and electrical interconnection functions into a single integrated structure.
Solution Approach 2:
The thermal clip serves multiple functions simultaneously: it acts as a heat sink for thermal management, provides mechanical support for the semiconductor die, and serves as an electrical connection element through its integration with the lead frame. This multi-functionality reduces the need for separate components.
2Manufacturing precision
If packaged semiconductor devices are designed for specific footprint, then manufacturing precision is improved, but adaptability deteriorates
Solution Approach 1:
The patent segments the package structure into modular components: the lead frame with thermal clip forms a standardized base structure, while the semiconductor die can be varied in size and configuration. This segmentation allows the footprint-defining elements to remain consistent while accommodating different die specifications.
Solution Approach 2:
The lead frame and thermal clip assembly serves as a universal mounting structure that can accommodate multiple die sizes and configurations. The standardized footprint of the lead frame allows different semiconductor dies to be mounted on the same package type, enabling versatility while maintaining manufacturing precision.
3Volume of moving object
If semiconductor devices are made smaller for consumer electronics, then product size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent extends the heat dissipation structure vertically with the thermal clip rising from the lead frame plane, creating additional thermal management surface area in the vertical dimension rather than requiring increased horizontal footprint. This allows effective heat sinking in compact device footprints.
Solution Approach 2:
The thermal clip is constructed from materials with high thermal conductivity integrated into the lead frame structure, creating a composite assembly that provides superior heat dissipation capability relative to the small device size. The combination of lead frame material and thermal clip material optimizes both electrical and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal capacity through exposed thermal clips, versatility in attachment to PCBs, and simplified manufacturing, ensuring effective cooling and adaptability in semiconductor devices, comparable to 8-pin small outline package (SOP) and loss-free package (FLPAK) devices.
Implementation Method 1
a thermal clip with a first surface and a second surface wherein said second surface is connected to said drain region of said semiconductor die
Data Source
AI summary
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite ends of the device through a nonconductive molding material used to package the device. The thermal clip and source pad can be either top or bottom-exposed. The gate, source and drain leads are exposed through the molding material, and all leads are coplanar with the bottom-exposed surface. The device can have multiple semiconductor dies or various sized dies while still having a single, constant footprint. The method of manufacturing requires attaching the semiconductor die to a thermal clip, and then attaching the die with the attached thermal clip to a lead frame. The resulting device is then molded, marked, trimmed and singulated, in this order, creating a packaged semiconductor device with dual exposed surfaces.