PCB Through-Hole Layout for Void-Free Resin-Filled Chargers
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Solution Overview
Problem
Conventional chargers face challenges in heat dissipation and miniaturization due to increased heat generation, difficulty in evenly filling resin material, potential contact failures, and air pocket formation between components and the PCB, which hinders efficient heat dissipation and increases the risk of component damage.
Innovation Solution
The design incorporates an air-pocket prevention PCB with strategically placed through holes on the PCB to improve resin material flow and penetration, allowing air pockets to be discharged, and a manufacturing method that includes tilting and vibrating the case to ensure even resin filling and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the case is filled with resin material with high thermal conductivity to dissipate heat, then heat dissipation performance is improved, but air pockets are likely to form between components/PCB and resin material
Solution Approach 1:
The PCB is designed with through holes that create a porous structure, allowing the resin material to penetrate through the PCB and components. This enables air pockets to be discharged during resin filling while maintaining thermal conductivity, as the resin can fully contact the PCB surface and components without being blocked by air pockets.
Solution Approach 2:
The PCB is divided into multiple regions with through holes at different positions, segmenting the resin filling process into multiple flow paths. This segmentation allows air pockets to escape through multiple channels rather than being trapped in a single location, improving both heat dissipation and eliminating air pocket formation.
2Volume of moving object
If the space between components and PCB/case is reduced to achieve miniaturization, then device size is reduced, but it becomes difficult to insert resin material into injection nozzle and achieve even filling
Solution Approach 1:
The through holes provide an additional vertical dimension for resin material flow. Instead of relying solely on horizontal injection through narrow gaps, the resin can flow vertically through the through holes, bypassing the space constraints and enabling even filling in miniaturized devices with reduced component spacing.
Solution Approach 2:
The through holes act as intermediary channels that facilitate resin material flow into narrow spaces. These holes serve as mediators between the injection nozzle and the difficult-to-reach areas between components and PCB, enabling uniform resin distribution even when component spacing is minimized for miniaturization.
3Productivity
If components and PCB are assembled before injecting resin material, then assembly efficiency is improved, but contact failure may occur due to resin material at contact portions between electrical terminals and components/PCB
Solution Approach 1:
The through holes extract or remove the problematic air pockets from the assembly before resin filling. By providing escape paths for air through the through holes, the resin can make clean contact with electrical terminals and components without air pockets causing contact failure, while maintaining the benefit of pre-assembly for improved productivity.
4Temperature
If conventional chargers use sufficient size to dissipate heat by natural convection, then heat dissipation is achieved, but internal components are continuously exposed to over-temperature
Solution Approach 1:
The patent replaces natural convection (a mechanical/physical system relying on air movement) with direct thermal conduction through the resin material and PCB structure. The through holes enhance this conduction by ensuring complete resin contact, allowing heat to be efficiently transferred from components to the case without relying on convective air flow, thus protecting components from over-temperature while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents air pocket formation, enhances heat dissipation, and ensures efficient resin filling, thereby extending component lifespan and improving the overall performance and reliability of miniaturized chargers.
Implementation Method 1
improve fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged
Implementation Method 2
a passage portion including a plurality of through holes through which the resin material having a higher viscosity than water passes
Implementation Method 3
filling the case with a resin material with high thermal conductivity in the miniaturized charger
Implementation Method 4
a manufacturing method of an electrical device including the same with improved fluidity of a resin material
Implementation Method 5
manufacturing method that includes tilting and vibration to ensure even filling and curing of the resin material
Data Source
AI summary
The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.