Semiconductor Packaging Without Lead Frames
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Solution Overview
Problem
The high cost and material expense of lead frames and wiring substrates in semiconductor devices, particularly exacerbated by the need for stacking semiconductor devices, necessitate a cost reduction method for packaging semiconductor chips.
Innovation Solution
A semiconductor device and manufacturing method that eliminates the use of lead frames and wiring substrates by incorporating exposed metals and wires within a resin mold, allowing for efficient packaging of semiconductor chips without these expensive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frames or wiring substrates are used in semiconductor device packaging, then electrical connectivity and structural support are ensured, but material cost increases substantially
Solution Approach 1:
The patent extracts and eliminates the lead frame or wiring substrate from the semiconductor device structure. Instead of using these separate components, the invention integrates the electrical connection function directly into the resin body through embedded metal particles, thereby removing the source of high material cost while maintaining connectivity.
Solution Approach 2:
The invention merges the electrical connection function with the resin packaging material by embedding conductive metal particles within the resin. This combination creates an integrated structure where the resin serves both as packaging and as the medium for electrical connectivity, eliminating the need for separate lead frames or wiring substrates.
2Productivity
If the number of stacked semiconductor devices is increased, then packaging density improves, but material cost increases due to multiple lead frames and wiring substrates
Solution Approach 1:
By merging the packaging resin with the electrical connection function through embedded metal particles, the invention creates a unified structure that can be stacked without requiring separate lead frames or wiring substrates for each device layer. This integration dramatically reduces the cumulative material cost as packaging density increases.
Solution Approach 2:
The resin body with embedded metal particles serves multiple functions simultaneously: it provides mechanical packaging protection, establishes electrical connectivity, and enables stacking capability. This multi-functionality allows the same basic structure to be reused across multiple stacked layers without adding proportional material costs.
Data Source
AI summary
A semiconductor device has a first semiconductor chip 10 molded with a resin 12, a first metal 14 provided in the resin 12 in a circumference of the first semiconductor chip 10, and being exposed on a lower surface of the resin 12, a second metal 16 provided in the resin 12 over the first metal 14, and being exposed on an upper surface of the resin 12, and a first wire 18 coupling the first semiconductor chip 10 to the first metal 14 and the second metal 16. The first wire 18 is coupled to the first metal 14 and the second metal 16 so as to be sandwiched therebetween.