Array Substrate Metal Connection Line ESD Prevention
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Solution Overview
Problem
Electrostatic discharge (ESD) occurs between metal blocks and metal wires during the manufacturing process of array substrates due to equipment static electricity, friction static electricity, or process discharge, leading to an electric potential difference that cannot be counteracted, resulting in ESD events.
Innovation Solution
A manufacturing method that involves forming a metal connection line connected with both conductive patterns on the base substrate, ensuring equal voltages for the conductive patterns, and subsequently etching the connection line to insulate them, thereby balancing the electric potential difference and preventing ESD.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal blocks and metal wires are manufactured on the substrate during the array substrate manufacturing process, then the display device achieves high aperture ratio and proper circuit functionality, but electrostatic discharge (ESD) occurs between metal blocks and metal wires due to accumulated charges with different polarities
Solution Approach 1:
A grounding wire is introduced as an intermediary element between the metal blocks and metal wires. This grounding wire serves as a mediator to equalize the electric potential between different metal components by providing a common reference potential (ground), thereby preventing ESD events caused by potential differences. The grounding wire connects to the common electrode, establishing a stable reference potential that eliminates harmful voltage differentials.
Solution Approach 2:
The patent applies equipotentiality by connecting multiple metal components (metal blocks and metal wires) to a common grounding wire that is connected to the common electrode. This creates equipotential regions among the metal components, ensuring they all share the same electric potential (ground potential), thereby eliminating the electric potential difference that causes ESD.
2Ease of manufacture
If conventional manufacturing processes are used without additional ESD prevention measures, then the manufacturing process remains simple and cost-effective, but ESD events occur between metal blocks and metal wires
Solution Approach 1:
The grounding wire is merged with the existing common electrode structure. Instead of creating a completely separate grounding system, the patent utilizes the common electrode that already exists in the display device structure, connecting it to ground. This merging approach allows ESD prevention to be integrated into the existing manufacturing process without adding significant complexity or requiring entirely new manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents ESD events, enhancing the endurance capacity of the product against electrostatic discharge and increasing yield by maintaining equal voltages between conductive patterns and avoiding performance interference.
Implementation Method 1
etching the connection line to insulate them
Data Source
Figure 1~2a
Figure 2b~2c
Figure 2d~2e
AI summary
An array substrate and a manufacturing method thereof, a display panel and a display device are provided. The manufacturing method included: forming first conductive patterns (101; 201), second conductive patterns (102; 205) and metal connection lines (103, 202, 204) on a base substrate (100), the metal connection lines (103, 202, 204) being connected with the first conductive patterns (101; 201) and the second conductive patterns (102; 205); and etching the metal connection lines (103, 202, 204) to make the first conductive patterns (101; 201) and the second conductive patterns (102; 205) insulated from each other. In the embodiment of the present invention, the metal connection line is connected with the first conductive pattern and the second conductive pattern to balance an electric potential difference between the first conductive pattern and the second conductive pattern in a technological process, and therefore an occurrence probability of an electrostatic discharge phenomenon in technological process can be reduced, and a product yield is increased.