Array Substrate Groove Layout for Uniform Orientation Coating
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Solution Overview
Problem
In the manufacturing of liquid crystal display panels, poor coating of the orientation film on the array substrate leads to reduced yield and degraded picture quality due to uneven diffusion of the orientation liquid around connection via-holes in the insulating material layer, especially when an organic insulating layer is used.
Innovation Solution
A method of manufacturing an array substrate that includes forming a drive circuit layer, an insulating material layer with connection via-holes exposing drain electrodes, and an electrode layer with groove structures extending to the via-holes, guiding the orientation liquid for even diffusion and preventing accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an organic insulating layer is used in the array substrate, then the insulation performance is improved, but the orientation liquid accumulates around connection via-holes causing poor coating
Solution Approach 1:
The groove structures are formed in advance within the organic insulating layer before orientation liquid coating. These pre-formed grooves serve as designated pathways that guide the orientation liquid to flow uniformly across the substrate surface and into the connection via-holes, preventing accumulation and ensuring even coating quality while maintaining the insulation performance of the organic insulating layer.
2Manufacturing precision
If the orientation liquid is coated uniformly, then the coating quality is improved, but the via-holes cause accumulation and uneven diffusion
Solution Approach 1:
The organic insulating layer is designed with non-uniform local structure: groove structures are created specifically at locations corresponding to connection via-holes, while other regions remain as continuous insulating material. This local modification provides targeted pathways for orientation liquid flow at critical areas without compromising the overall insulation performance, enabling uniform liquid distribution despite the presence of via-holes.
3Manufacturing precision
If groove structures are added to guide orientation liquid, then the coating quality is improved, but the device complexity increases
Solution Approach 1:
The groove structures are integrated within the existing organic insulating layer during the same fabrication process, rather than being added as separate components. The grooves are formed by patterning and removing portions of the insulating layer material itself, merging the insulation function and the liquid guidance function into a single integrated structure, thereby improving coating quality without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The groove structures on the electrode layer facilitate uniform diffusion of the orientation liquid into the via-holes, improving the coating quality and reducing defects in the display panel, thereby enhancing both the yield of the array substrate and the picture quality.
Implementation Method 1
The groove structures on the electrode layer facilitate uniform diffusion of the orientation liquid into the via-holes
Data Source
AI summary
The present disclosure provides an array substrate and a method of manufacturing the same and a display panel, which belongs to the field of display technologies. The method of manufacturing the array substrate comprises: providing a base substrate; forming a drive circuit layer on the base substrate, wherein the drive circuit layer includes a switching transistor; forming an insulating material layer on one side of the drive circuit layer distal to the base substrate, wherein the insulating material layer has a connection via-hole exposing at least a part region of a drain electrode of the switching transistor; and forming an electrode layer on one side of the insulating material layer distal to the base substrate, wherein a surface of the electrode layer distal to the base substrate has groove structures extending to the connection via-hole. The manufacturing method may avoid the occurrence of poor coating in forming an orientation layer.