Array Substrate Inorganic Layer Removal for Crack Prevention
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Solution Overview
Problem
Cracks are easily formed in the inorganic layer of OLED devices during the cutting process, which can lead to device failure and affect the performance of flexible OLED devices.
Innovation Solution
A method for manufacturing an array substrate involves forming an inorganic layer on a base substrate, defining a preset region, and removing the inorganic layer in that region using a photolithography process, followed by cutting the base substrate along a new side edge formed after the inorganic layer removal, thereby avoiding stress and heat-related cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the inorganic layer is removed together with the base substrate during cutting, then the cutting process is simple and fast, but cracks are easily formed in the inorganic layer due to stress and heat
Solution Approach 1:
The patent divides the manufacturing process into two separate stages: first removing the inorganic layer through photolithography and etching, then performing cutting on the base substrate. This segmentation prevents the inorganic layer from being damaged during cutting, resolving the contradiction between cutting speed and crack prevention.
Solution Approach 2:
The inorganic layer is removed in advance before the cutting process. By performing the inorganic layer removal as a preliminary action, the subsequent cutting operation only affects the base substrate, eliminating stress and heat-induced cracks in the inorganic layer while maintaining efficient production.
2Manufacturing precision
If the inorganic layer is removed using photolithography and etching before cutting, then cutting precision is improved and cracks are prevented, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The patent segments the manufacturing process into distinct steps: photolithography to form a mask, etching to remove the inorganic layer, and finally cutting. This segmentation allows each step to be optimized independently, achieving high cutting precision while managing process complexity through systematic organization.
Solution Approach 2:
The inorganic layer removal is performed as a preliminary action with well-established photolithography and etching techniques. By completing this preparation step beforehand, the subsequent cutting process can be precisely controlled without the complications of managing the inorganic layer, thus improving precision while the added steps are offset by the simplicity of each individual operation.
3Reliability
If the inorganic layer is removed before cutting, then stress and heat-induced damage is prevented, but additional process steps are required
Solution Approach 1:
The inorganic layer removal is performed as a preliminary action using standard photolithography and etching processes. Although this adds process steps, it prevents stress and heat-induced damage during cutting, ensuring high reliability. The additional time is justified by the elimination of potential defects and rework.
Solution Approach 2:
The inorganic layer is extracted and removed from the structure before the cutting process. By taking out the vulnerable inorganic layer beforehand, the subsequent cutting operation can proceed without causing stress or heat damage, achieving high reliability despite the additional process time required for removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the likelihood of cracks in the inorganic layer and improves cutting precision, enhancing the yield and performance of OLED devices by separating the inorganic layer removal from the cutting process, thus preventing stress and heat-induced damage.
Implementation Method 1
exposing and developing the inorganic layer coated with the resist to remove the resist in the preset region
Implementation Method 2
etching the inorganic layer by using a mask formed by the resist remaining in a non-preset region, to remove the inorganic layer in the preset region
Implementation Method 3
cutting the base substrate or the base substrate together with one or more layers on the base substrate in the preset region
Data Source
AI summary
A method for manufacturing an array substrate, an array substrate and a display panel are provided herein. The method for manufacturing the array substrate includes: forming an inorganic layer on a base substrate; defining a preset region in a marginal region of the base substrate, and removing the inorganic layer in the preset region; and cutting the base substrate or the base substrate together with one or more layers on the base substrate in the preset region.