Bending-Area Array Substrate Lap Joint for Low-Resistance Signal Routing
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Solution Overview
Problem
Conventional array substrate structures require multiple layers of connection lines in the bending area, leading to high electrical resistance and poor contact, which hinders efficient signal transmission.
Innovation Solution
The array substrate features a recessed inorganic stacked layer with first metal lines in the non-bending area and a second metal line forming a lap joint with the first metal lines in the bending area, reducing the number of connection lines needed and improving contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of connection lines are used in the bending area, then electrical connection between signals at two sides of the bending area is achieved, but electrical resistance of lines increases and contact quality deteriorates
Solution Approach 1:
The patent merges multiple connection line layers into a single layer by using a planarization layer to flatten the surface, allowing first metal lines from different original layers to be connected in the same plane through the second metal line, thereby reducing the number of layers while maintaining connection reliability
Solution Approach 2:
The planarization layer acts as an intermediary that bridges the gap between multiple original metal line layers, enabling the first metal lines to be connected through the second metal line in a simplified single-layer configuration while maintaining electrical connection quality
2Reliability
If multiple layers of connection lines are used in the bending area, then electrical connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple manufacturing steps for creating separate metal line layers into a single step by forming all metal lines in one layer, simplifying the manufacturing process while ensuring good contact quality through the lap joint configuration
Solution Approach 2:
The planarization layer serves as a manufacturing intermediary that enables simplified single-layer metal line formation while achieving the same electrical connection function that would otherwise require multiple layers, reducing manufacturing complexity
3Reliability
If first source/drain layer, second source/drain layer, and gate electrode are connected many times in the bending area, then connection is achieved, but electrical resistance of signal lines increases significantly
Solution Approach 1:
The patent merges multiple connection paths into a single optimized path by forming all metal lines in one layer with direct lap joint connections, eliminating the need for multiple repeated connections and thereby reducing electrical resistance and energy loss
Solution Approach 2:
The patent extracts the essential connection function from the complex multi-layer, multi-connection structure and implements it through a simplified single-layer lap joint configuration, removing unnecessary connection repetitions that caused high electrical resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient electrical connection between signals at the bending area with reduced electrical resistance and improved contact, addressing the limitations of conventional structures.
Implementation Method 1
an inorganic stacked layer disposed on the substrate layer, wherein the inorganic stacked layer is provided with a recess in the bending area
Implementation Method 2
a filling layer filled in the recess
Implementation Method 3
the first metal lines and the second metal line form a lap joint at two sides of the bending area
Data Source
AI summary
An array substrate, a manufacturing method thereof, and a display panel are provided. The array substrate includes a bending area and a non-bending area, and further includes an inorganic stacked layer disposed on a substrate layer. A recess is formed on the inorganic stacked layer in the bending area. A plurality of first metal lines are disposed in the inorganic stacked layer at two sides of the bending area. A filling layer is filled in the recess. The array substrate further includes a second metal line disposed on the inorganic stacked layer and the filling layer, and the first metal lines at the two sides of the bending area form a lap joint by the second metal line.