Array Substrate Lead Impedance Matching via Capacitive Semiconductor
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Solution Overview
Problem
Different lead impedances on an array substrate result in varying data signals or clock signals when transmitted through different leads, leading to poor image uniformity in displays using these substrates.
Innovation Solution
The array substrate incorporates a lead structure with a conductive semiconductor structure that forms a capacitor with a first conductive structure, allowing for adjustment of impedance by changing the position and length of the conductive semiconductor structure, ensuring consistent signal transmission across multiple conductive structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different leads are used to conduct the same data signals or clock signals, then the array substrate can accommodate multiple signal paths, but the impedance differences of different leads cause the transmitted signals to vary, resulting in poor image uniformity
Solution Approach 1:
The patent adjusts the impedance parameters of leads by modifying the geometric dimensions (width, length, shape) of conductive structures. Different lead structures are designed with specific dimensional parameters to achieve substantially equal impedance values, ensuring consistent signal transmission across all leads while maintaining the ability to accommodate multiple signal paths
Solution Approach 2:
The patent employs asymmetric lead structures where leads with different widths, lengths, or shapes are designed to compensate for impedance differences. By creating intentionally asymmetric geometries, the patent achieves impedance matching across diverse lead configurations, allowing versatile signal transmission while maintaining signal consistency
2Reliability
If the width and length of conductive structures are adjusted to equalize impedance, then signal consistency can be improved, but the design complexity and manufacturing precision requirements increase
Solution Approach 1:
The patent applies different geometric characteristics to different portions of lead structures. Specific local regions of leads are designed with varied widths, lengths, or shapes to achieve impedance matching, while other regions maintain standard dimensions. This localized differentiation allows impedance equalization without requiring extreme manufacturing precision across the entire structure
Solution Approach 2:
The patent modifies geometric parameters (width, length, shape) of conductive structures within standard manufacturing tolerances to achieve impedance equalization. By selecting parameter adjustments that fall within normal fabrication capabilities, the patent improves signal consistency while avoiding excessive manufacturing precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that all conductive structures transmit the same data or clock signals, improving the display effect by maintaining uniformity and consistency in image quality.
Implementation Method 1
The lead structure includes a first conductive structure and a conductive semiconductor structure, and an orthographic projection of the conductive semiconductor structure on the base at least partially overlaps an orthographic projection of the first conductive structure on the base
Data Source
AI summary
The present disclosure provides an array substrate, including: a base, and at least one lead structure disposed on the base. The lead structure includes a first conductive structure and a conductive semiconductor structure, and an orthographic projection of the conductive semiconductor structure on the base at least partially overlaps an orthographic projection of the first conductive structure on the base.