Array Substrate Notch Sidewall Slope Control
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Solution Overview
Problem
The steep notch sidewalls in the metal film of array substrates cause subsequent film layers to slip easily, leading to incomplete coverage and performance issues in display panels.
Innovation Solution
The formation of a first notch with a first groove and a second groove in the metal film, where the bottom surface of the first groove is closer to the substrate than the second groove, reduces the sidewall slope and prevents film layer slippage, allowing for complete coverage during subsequent film layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a mask with openings is used to etch the metal film, then the gate electrodes, capacitor plates and wires are formed, but the notch sidewalls become relatively steep causing subsequent film layers to slip easily
Solution Approach 1:
The mask opening is segmented into multiple regions with different light transmittance (first opening region with first light transmittance, second opening region with second light transmittance). This segmentation creates different exposure intensities that form notches with varying depths, resulting in stepped sidewalls instead of uniformly steep walls, thereby preventing film layer slippage while maintaining formation efficiency
Solution Approach 2:
Different regions of the mask opening are assigned different light transmittance properties to create local variations in etching depth. The first opening region allows more light through creating a deeper notch, while the second opening region allows less light creating a shallower notch. This local quality differentiation produces stepped sidewalls that provide better mechanical support for subsequent film layers
2Productivity
If the notch sidewalls are steep, then the etching process is efficient, but the other film layers are not able to completely cover the metal film
Solution Approach 1:
The etching process is segmented into stages by using a mask with multiple opening regions of different light transmittance. This creates notches with stepped sidewalls at different depths, maintaining etching efficiency while preventing the complete slippage of subsequent film layers that would occur with uniformly steep walls
Solution Approach 2:
The stepped sidewall structure acts as an intermediary between the steep notch walls and the subsequent film layers. The intermediate steps provide mechanical support and anchoring points that prevent complete slippage, ensuring reliable coverage while preserving the efficiency benefits of deep etching
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the performance of array substrates by ensuring complete coverage of the metal film, reducing the likelihood of short circuits and open circuits, and enhancing the overall quality of the display panel.
Implementation Method 1
subjecting the photoresist to exposure so as to form a first strong exposure area facing the light-transmitting hole and a weak exposure area facing the semi-permeable membrane in the photoresist
Data Source
AI summary
An array substrate, a fabrication method of the array substrate and a mask, where a metal film is provided on a substrate, a first groove and a second groove are formed on the metal film, the bottom surface of the first groove is closer to the substrate compared to that of the second groove, a projection of the first groove on a plane parallel to the substrate is located within that of the second groove, thereby reducing a slope of a notch sidewall, avoiding the sliding of formed subsequent film layers off the first notch sidewall; the metal film may be covered by the subsequent film layers, improving the performance of the array substrate.