Array Substrate Electrode Surface Treatment to Prevent Passivation Undercut
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Solution Overview
Problem
Passivation undercut during the etching process in the manufacturing of LCD array substrates leads to abnormal display issues in LCD panels, affecting their quality and yield.
Innovation Solution
A manufacturing method for array substrates involving the formation of a base layer, semiconductor layer, metal layer with a first nitride or oxide surface, and a passivation layer with a corresponding second nitride or oxide structure, which enhances adsorption affinity and reduces undercut during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional metal layer is used for source/drain electrode without surface treatment, then the manufacturing process is simple, but passivation undercut occurs during etching leading to abnormal display
Solution Approach 1:
The patent applies preliminary action by forming a first nitride or first oxide layer on the metal layer surface before the etching process. This pre-treatment creates a surface structure that prevents passivation undercut during subsequent etching, thereby improving display quality without adding significant process complexity
Solution Approach 2:
The first nitride or first oxide layer acts as an intermediary between the metal layer and the passivation layer. This intermediate layer modifies the surface properties to prevent direct adverse interaction between the passivation layer and metal layer during etching, eliminating passivation undercut while maintaining process simplicity
2Manufacturing precision
If the passivation layer is deposited directly on the metal layer without surface treatment, then the deposition process is simple, but the passivation layer does not fit closely to the source/drain electrode causing undercut
Solution Approach 1:
The patent applies local quality by creating a specific surface structure (first nitride or first oxide) only on the upper surface of the metal layer where the passivation layer will be deposited. This localized surface treatment improves fitting precision at the critical interface without complicating the overall deposition process
Solution Approach 2:
The patent changes the surface parameters of the metal layer by forming a nitride or oxide layer, which modifies surface energy, roughness, or chemical composition. This parameter change enhances the adsorption affinity between the passivation layer and metal layer, achieving better fitting precision while maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the fitting of the passivation layer to the source/drain electrode, minimizing undercut and increasing the yield and quality of the display panel by ensuring a uniform and stable connection.
Implementation Method 1
the two nitrogen-containing structures or oxygen-containing structures produce adsorption affinity, so that the passivation layer is fitted more closely to the source/drain electrode
Data Source
AI summary
The present application discloses an array substrate, a manufacturing method therefor and a display panel. The manufacturing method for the array substrate includes steps of: forming a base layer; forming a semiconductor layer on the base layer; forming a metal layer on the semiconductor layer, where the upper surface of the metal layer contains a first nitride or a first oxide; etching the metal layer into a source/drain electrode; and forming a passivation layer on the source/drain electrode, where the passivation layer is a second nitride structure corresponding to the first nitride or a second oxide structure corresponding to the first oxide.