Array Substrate Pedestal Layout for Fine LCD Sub-Pixels
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Solution Overview
Problem
Conventional liquid crystal display devices face challenges in achieving high definition and improved moving image display capabilities due to low adherence between semiconductor layers and transparent conductive materials, leading to conduction failures and manufacturing difficulties in patterning thin signal lines and pedestals.
Innovation Solution
The implementation of a semiconductor layer, scanning line, signal line, pedestal, and pixel electrode configuration, where the signal line and pedestal are formed in different layers with good adherence, allowing for indirect connection through a pedestal made of metal, thereby preventing conduction failures and enabling finer sub-pixel formation without requiring extreme processing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the thickness of the signal line is increased to prevent video signal delay, then the moving image display capability is improved, but the manufacturing precision required for patterning increases
Solution Approach 1:
The patent transitions from planar signal lines to three-dimensional signal lines that extend in the thickness direction. This vertical dimension allows the signal lines to achieve sufficient thickness for low-resistance signal transmission without increasing lateral dimensions, thereby avoiding the need for higher patterning precision while maintaining improved moving image display capability.
Solution Approach 2:
The patent combines multiple functions into the signal line structure: electrical signal transmission, mechanical support for the pixel electrode, and spacing maintenance. By forming the signal line as a pedestal structure that the pixel electrode sits upon, the patent achieves both adequate thickness for electrical performance and simplified manufacturing without requiring extreme patterning precision.
2Reliability
If a metallic pedestal is interposed between the semiconductor layer and the pixel electrode to improve adherence, then the electrical connection reliability is improved, but the device complexity increases
Solution Approach 1:
The metallic pedestal structure serves multiple functions simultaneously: it provides a reliable electrical connection between the semiconductor layer and pixel electrode, acts as a mechanical support for the pixel electrode, maintains spacing between adjacent pixels, and serves as a bonding surface for the color filter layer. This multi-functionality reduces overall device complexity despite the added metallic layer.
Solution Approach 2:
The metallic pedestal acts as an intermediary element that resolves the adherence problem between the semiconductor layer and transparent conductive material. By introducing this intermediate metallic layer with good adhesion properties to both materials, the patent achieves reliable electrical connections without requiring direct contact between incompatible materials, thereby simplifying the overall connection structure.
Data Source
AI summary
According to one embodiment, an array substrate includes a semiconductor layer, scanning and signal lines, first and second insulating layers, a pedestal and a pixel electrode. The scanning line is opposed to the semiconductor layer. The first insulating layer is provided above the semiconductor layer. The signal line and the pedestal are connected to the semiconductor layer through first and second contact holes in the first insulating layer. The second insulating layer is provided above the pedestal. The pixel electrode is connected to the pedestal through a third contact hole in the second insulating layer. The signal line and the pedestal are provided in layers different from each other.