Array Substrate Repair Line Layout for Multiple Data Line Defects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional repair line structures in array substrates are limited in their ability to repair multiple defective data lines, resulting in low yield and inefficiency.
Innovation Solution
The implementation of multiple repair line sets on an array substrate, where each set includes intersecting repair lines and a second signal line connected to a driving circuit, allows for the simultaneous repair of multiple defective first signal lines by electrically connecting them to the repair lines and second signal lines through a process involving laser ablation and metal sputtering for insulation removal and metal deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional repair line structures with one or two repair lines are used, then the device complexity is low, but the productivity and yield are limited due to the small number of repair lines
Solution Approach 1:
The patent divides the repair function into multiple independent repair line sets, where each set contains multiple repair lines that can independently repair different defective data lines. This segmentation allows simultaneous repair of multiple defects without increasing overall system complexity significantly, as each repair line set operates independently.
Solution Approach 2:
Each repair line set is designed to serve multiple functions by containing multiple repair lines that can repair different data lines. The repair lines within each set can be selectively activated based on the location and number of defects, making the repair system universal and adaptable to various defect scenarios.
2Productivity
If multiple repair line sets are implemented to repair multiple defective data lines, then the productivity and yield increase, but the device complexity increases due to additional repair lines and signal lines
Solution Approach 1:
The patent merges multiple repair lines into organized repair line sets, where repair lines within each set share common control and connection structures. This merging approach reduces the overall complexity compared to having completely independent repair lines, as common structures are shared across multiple repair lines within a set.
Solution Approach 2:
The patent organizes repair lines in a two-dimensional arrangement with multiple repair line sets positioned at different locations on the array substrate. This spatial dimensionality allows multiple repair operations to occur simultaneously without interfering with each other, effectively managing complexity through spatial distribution.
3Ease of repair
If repair lines intersect with data lines, then the repair functionality is achieved, but the manufacturing precision and alignment accuracy become critical
Solution Approach 1:
The patent designs the repair lines and their intersection points with data lines during the manufacturing planning stage, establishing predetermined repair paths and connection points. This preliminary design allows for pre-calculated alignment tolerances and reduces the precision requirements during actual manufacturing, as the intersection geometry is optimized in advance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the yield by enabling the effective repair of multiple defects without affecting the overall display area, ensuring consistent and efficient signal transmission.
Implementation Method 1
a region of the insulating film between the first signal line and the repair line is removed by using a laser beam
Implementation Method 2
a metal layer is formed on the array substrate by using a metal sputtering method
Data Source
Figure 1~2
Figure 3
AI summary
Embodiments of the present disclosure provide an array substrate, including: a base substrate; one or more first signal lines provided on the base substrate; a plurality of repair line sets also provided on the base substrate and configured to repair the first signal lines, each of the repair line sets comprising one or more repair lines which intersect with and are insulated from at least one of the first signal lines; and one or more second signal lines also provided on the base substrate, at least one of the one or more second signal lines having one end which is arranged to intersect with and be insulated from the one or more repair lines, and the other end which is connected to a driving circuit for supplying an electrical signal to the one or more first signal lines, wherein the second signal line is different from the first signal line. The plurality of repair line sets is sequentially disposed on the entire base substrate in a first transverse direction of the base substrate.