Array Substrate Combining Sensing Material with Thin Film Transistors
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Solution Overview
Problem
Current inductive sensors for mobile security, such as fingerprint recognition, are costly and have small sensor areas, leading to insufficient device functions and performance due to their silicon-based chip fabrication.
Innovation Solution
An array substrate is developed that combines a sensing material with thin film transistors to form a sensing layer, allowing for large-area preparation of sensors, integrating them into a display panel to enhance performance and reduce production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inductive sensors are fabricated based on silicon-based chips, then manufacturing precision is improved, but production cost increases and sensor area decreases
Solution Approach 1:
The patent changes the fabrication substrate from silicon-based chips to glass substrates, enabling large-area preparation of sensors through TFT technology while maintaining sensing functionality. This parameter change resolves the contradiction by achieving both acceptable precision and reduced cost through a different material platform
Solution Approach 2:
The patent copies the successful large-area TFT fabrication process onto sensor fabrication, adapting the proven glass-substrate-based TFT manufacturing methodology for sensor production. This allows replication of the cost-effective, large-area manufacturing approach while maintaining sensing capabilities
2Manufacturing precision
If inductive sensors are fabricated based on silicon-based chips, then manufacturing precision is improved, but sensor area decreases
Solution Approach 1:
The patent changes the substrate material from silicon to glass and adopts TFT fabrication technology, enabling sensors to be produced in large areas (e.g., 5 inches or larger) while maintaining functional precision through the adapted fabrication process
Solution Approach 2:
The patent transitions from small, discrete silicon chip-based sensors to large-area continuous sensor arrays fabricated on glass substrates, effectively moving from a two-dimensional chip constraint to a larger planar fabrication dimension enabled by TFT technology
3Ease of manufacture
If sensors are formed by large-area preparation, then production cost is reduced and sensor area is improved, but integration with display panel is required
Solution Approach 1:
The patent merges the sensor fabrication process with the display panel manufacturing process by forming sensors and TFTs on the same glass substrate using identical fabrication steps. This integration eliminates separate production and assembly steps, reducing overall complexity despite the advanced manufacturing requirements
Data Source
AI summary
An embodiment of the present invention discloses an array substrate, a method of fabricating the same, and a display panel. Compared with the conventional technology, the present invention combines a sensing material with thin film transistors to prepare a sensing layer on the thin film transistors, and since the thin film transistors can be formed by a large-area preparation, the sensors can be formed by a large-area preparation accordingly, thereby improving a performance of the sensors and reducing the production cost of the sensors.