Array Substrate Shielding Ring for Via Hole Corrosion
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Solution Overview
Problem
Conduction layers exposed on the surface of via holes in TFT-LCD manufacturing are prone to corrosion due to surrounding electric fields, leading to contact failures between metal layers.
Innovation Solution
A conductive material shielding ring is provided around the conduction layer, insulated from it, to prevent corrosion and ensure reliable electrical connections between metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conduction layer is used as connection medium in via holes, then electrical connection between different metal layers is implemented, but the conduction layer is prone to corrosion due to surrounding electric field
Solution Approach 1:
A shielding layer is introduced as an intermediary component between the conduction layer and the surrounding environment. This shielding layer acts as a mediator that blocks harmful electric fields from reaching the conduction layer, thereby preventing corrosion while maintaining the electrical connection function. The shielding layer is positioned adjacent to the conduction layer in the via hole structure, creating a protective barrier without interfering with the conduction path.
2Ease of manufacture
If conduction layer is exposed on via hole surface, then via hole connection is achieved, but contact failure occurs due to corrosion
Solution Approach 1:
The shielding layer is formed in advance during the manufacturing process, before the conduction layer is deposited or exposed. By pre-positioning the shielding layer within the via hole structure, the conduction layer is protected from corrosion from the outset. This preliminary protective action ensures that when the conduction layer is subsequently exposed and connected, it remains resistant to corrosion-induced contact failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding ring effectively prevents corrosion of the conduction layer, thereby avoiding contact failures and extending the service life of the display panel by shielding it from the surrounding electromagnetic field.
Implementation Method 1
a conductive material shielding ring surrounding the third pattern, where the conductive material shielding ring is insulated from the third pattern
Data Source
AI summary
Disclosed are an array substrate and a manufacturing method therefor, and a display panel. The array substrate includes a first metal layer including a first pattern; a second metal layer including a second pattern; a conduction layer located above the first metal layer and the second metal layer and including a third pattern; a first via hole adapted to connect the first pattern and the third pattern; a second via hole adapted to connect the second pattern and the third pattern; and a conductive material shielding ring surrounding the third pattern, where the conductive material shielding ring is insulated from the third pattern.