Array Substrate Signal Line Segmentation and Layer Separation
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Solution Overview
Problem
The intersection of leads and signal lines in array substrates during encapsulation can cause short circuits due to silicon balls in the sealant squeezing and crushing the film layer, leading to damage of intermediate layers.
Innovation Solution
The array substrate design includes signal lines with separation regions and leads that intersect without being in the same layer, allowing for disconnection and reconnection via leads in different layers, preventing direct intersection and potential damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If leads and signal lines are provided in the same layer and intersect, then connection between signal lines is achieved, but silicon balls in sealant may squeeze and crush the film layer causing short circuit
Solution Approach 1:
The patent applies dimensionality change by moving the second lead to a different layer (upper or lower layer) than the second signal line. This spatial separation in the vertical dimension prevents the intersection problem while maintaining electrical connection functionality, thereby avoiding the short circuit issue caused by silicon ball squeezing.
Solution Approach 2:
The second signal line is divided into two separated parts with a separation region between them. This segmentation allows the first lead to pass through the separation region and connect to the second signal line without intersecting with it in the same layer, thus preventing the harmful squeezing effect while maintaining connectivity.
2Productivity
If leads pass through separation regions to intersect with signal lines, then signal transmission is enabled, but intermediate layers may be damaged due to silicon ball squeezing
Solution Approach 1:
By relocating the second lead to a different layer, the patent eliminates the need for the lead to pass through the separation region in the same layer as the signal line. This dimensional separation prevents intermediate layer damage while maintaining signal transmission capability through the lead-signal line connection in different layers.
3Reliability
If signal lines are disconnected to avoid intersection, then short circuit is prevented, but signal transmission continuity may be affected
Solution Approach 1:
The second signal line is segmented into two parts with a separation region, but electrical continuity is maintained through the first lead that connects these separated parts. This segmentation approach prevents intersection-related short circuits while ensuring signal transmission continuity through the connecting lead structure.
Solution Approach 2:
The first lead acts as an intermediary element that connects the two separated parts of the second signal line. This intermediary connection ensures signal transmission continuity while allowing the signal line to be discontinuous in the same layer, thus preventing short circuits at intersection regions.
Data Source
AI summary
The present disclosure belongs to the field of display and discloses an array substrate and a method for manufacturing the same, and a display apparatus. The array substrate comprises a first signal line and a second signal line provided side by side in a same direction and in a same layer, the second signal line comprising two separated parts, and a separation region being provided between the two separated parts; a first lead, configured to be connected to the first signal line, and pass through the separation region, so as to intersect with the second signal line; and a second lead, configured to be in a layer different than that of the second signal line, and conned the two separated parts.