Array Substrate Stress Buffer for Crack Resistance
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Solution Overview
Problem
Displays with profiled screens often experience cracking during perforation or cutting, leading to contamination and performance issues due to stress and temperature changes in inorganic layers.
Innovation Solution
An array substrate with a stress buffer structure incorporating a phase change material, where the phase change material is strategically positioned with a lower height than adjacent layers, and a method involving phase change treatments to control the material's state for crack resistance, including the use of photoisomerized or thermal phase change materials and barriers to manage stress and prevent longitudinal cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If perforation or cutting is performed on displays with profiled screens, then components such as camera and sensor can be placed in the opening, but longitudinal cracks occur due to stress and temperature changes in inorganic layers
Solution Approach 1:
A stress buffer structure is formed adjacent to the opening in the array substrate before the perforation or cutting process. This stress buffer structure absorbs and distributes the stress generated during perforation or cutting, preventing longitudinal cracks from propagating through the inorganic layers. The stress buffer acts as a cushioning element that mitigates the harmful effects of stress concentration at the opening edges.
Solution Approach 2:
The stress buffer structure is locally positioned adjacent to the opening where stress concentration occurs during perforation or cutting. By concentrating the stress-absorbing function in this specific location rather than throughout the entire substrate, the solution effectively addresses the crack propagation issue at the critical region while maintaining the overall structural integrity and component placement capability of the display.
2Reliability
If stress buffer structure is added to prevent cracking, then crack resistance is improved, but device complexity increases
Solution Approach 1:
The stress buffer structure is implemented only in the specific region adjacent to the opening where stress concentration occurs during perforation or cutting. This localized approach provides effective crack resistance at the critical location without adding unnecessary complexity to the entire device structure. The stress buffer's dimensions and position are optimized to address only the necessary area, maintaining simplicity in non-critical regions.
Solution Approach 2:
The stress buffer structure may utilize composite material compositions that combine different materials with complementary properties to achieve effective stress absorption and crack prevention. By using composite materials, the stress buffer can provide enhanced mechanical properties and stress distribution capabilities within a compact structure, reducing the overall complexity compared to using larger single-material structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stress buffer structure effectively blocks the extension of longitudinal cracks, improving the quality and integrity of the array substrate by facilitating lateral cracking and preventing external contaminants from entering, thus enhancing the display's performance.
Implementation Method 1
performing a first phase change treatment on the phase change material to change the phase change material from a first phase state to a second phase state
Implementation Method 2
the photoisomerized material includes an azobenzene compound
Data Source
AI summary
The disclosure relates to an array substrate and a method for fabricating an array substrate. The array substrate includes a base substrate, a cover layer on the base substrate, an opening at least partially passing through the cover layer, a stress buffer structure adjacent to the opening and on a side of the cover layer facing the base substrate, wherein the stress buffer structure includes a phase change material, wherein a height of a portion of the cover layer on the phase change material is lower than a height of a portion of the cover layer adjacent to the phase change material.