Array Substrate Through-Hole Structure to Prevent Source/Drain Breakage
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Solution Overview
Problem
The existing array substrates are prone to a breaking risk of side-walls of the source/drain layer due to the high angle of through-holes connected to the source/drain layer, which can lead to structural instability and potential failures in OLED display technology.
Innovation Solution
The proposed array substrate design includes a through-hole with a first groove and a second groove connected to each other, where the interlayer insulating layer is depressed to form the first groove and the bottom surface of the first groove is extended to the active layer, creating a step at the connecting position between the grooves, thereby altering the climbing height of the source/drain layer and preventing the breaking phenomenon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the through-hole angle is increased to improve connection efficiency, then the source/drain layer can be connected more effectively to the active layer, but the side-walls of the source/drain layer become prone to breaking due to excessive climbing height
Solution Approach 1:
The through-hole is divided into two segments: a first groove extending from the interlayer insulating layer to a first depth, and a second groove extending from the first groove to the active layer. This segmentation reduces the climbing height of the source/drain layer in each segment, preventing side-wall breaking while maintaining connection reliability.
Solution Approach 2:
The through-hole structure is transformed from a single vertical hole into a multi-level structure with steps at different depths. The first groove and second groove create horizontal dimension changes (terraces) that reduce the vertical climbing burden on the source/drain layer, distributing the stress across multiple levels rather than a single continuous climb.
2Ease of manufacture
If a straight through-hole is used to simplify the structure, then manufacturing is easier, but the source/drain layer side-walls are prone to breaking due to excessive climbing height
Solution Approach 1:
The through-hole fabrication is segmented into two distinct etching processes: first forming the first groove through the interlayer insulating layer, then forming the second groove through the first groove to reach the active layer. This segmentation allows each etching step to be optimized independently, maintaining manufacturing ease while ensuring structural integrity.
Solution Approach 2:
The first groove is formed in advance before forming the second groove. This preliminary action creates a staged structure where the source/drain layer can be deposited or filled in a way that accommodates the stepped geometry, preventing side-wall breaking while maintaining a relatively simple manufacturing sequence.
Data Source
AI summary
The present invention provides an array substrate and a manufacturing method thereof, and a display panel. According to the present disclosure, a portion of a surface of an interlayer insulating layer of the array substrate away from a substrate is depressed to form a first groove, a portion of a surface of the first groove near a bottom surface of the substrate is depressed until a surface of an active layer away from the substrate forms a second groove, and the first groove and the second groove are connected with each other to form a through-hole.