Array Substrate Via-Hole Backside Connection Narrow Bezel
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Solution Overview
Problem
Current display technologies require lead wires at the edge of display panels for connecting gate and data lines to external integrated circuits, necessitating a bezel width and preventing narrow or bezel-less designs.
Innovation Solution
The implementation of an array substrate with signal lines on one side and electrodes on the opposite side, connected via via-holes and connecting electrodes, allowing direct electrical connection to external integrated circuits without the need for edge lead wires, thus eliminating the requirement for a bezel or reducing its size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If lead wires are provided at the edge of display panel for connecting to external integrated circuit, then electrical connection is achieved, but bezel width must be reserved and narrow bezel or bezel-less design cannot be achieved
Solution Approach 1:
The patent moves the electrical connection interface from the edge dimension to the backside dimension of the display panel. By providing electrodes on the backside of the array substrate and connecting them through via-holes to signal lines on the front side, the connection point is relocated to another dimension (from edge to backside), enabling narrow bezel or bezel-less front designs while maintaining electrical connectivity through the backside interface.
Solution Approach 2:
The patent embeds connecting electrodes within via-holes that penetrate through the array substrate. The via-holes are formed by etching through the substrate, and connecting electrodes are deposited inside these holes, creating a nested structure where the connecting electrode is contained within the via-hole cavity, allowing electrical connection without edge lead wires.
2Length of moving object
If via-holes and connecting electrodes are used to connect signal lines to electrodes on the opposite side, then edge lead wires are eliminated, but manufacturing process complexity increases
Solution Approach 1:
The patent combines multiple functions into the via-hole structure: it serves as both the connection pathway and the embedding cavity for the connecting electrode. The via-hole formation process is integrated with the existing array substrate manufacturing process, and the connecting electrode deposition is combined with other electrode formation steps, reducing overall process complexity despite the added functionality.
Data Source
AI summary
The present disclosure provides an array substrate, a method for manufacturing the array substrate and a display device. The array substrate includes a base substrate and a signal line provided in a display region at a first side of the base substrate, an electrode is provided at a second side of the base substrate, the second side of the base substrate is opposite to the first side of the base substrate, a via-hole penetrating through the base substrate is provided at a position of the base substrate at which the electrode is provided, a connecting electrode is provided in the via-hole, and the signal line is electrically connected to the electrode provided at the second side of the base substrate through the connecting electrode.