Array Substrate Via Hole Repair for Color Filter Protection
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Solution Overview
Problem
The existing methods for maintaining array substrates by depositing particles generated by a photothermal reaction to reconnect disconnected signal lines can damage the color filter layer, leading to defects such as discoloration and surface unevenness, potentially scrapping the array substrate.
Innovation Solution
The array substrate design includes a base substrate with a signal line layer, a color filter layer, and a common line layer, where the common lines are insulated and form a grid-like structure with overlapping areas, allowing for the creation of via holes that enable connection of disconnected signal lines without direct heat application, thereby preventing damage to the color filter layer during repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If particles are deposited using photothermal reaction to reconnect disconnected signal lines, then the signal line connection is restored, but the color filter layer is damaged causing discoloration and surface unevenness
Solution Approach 1:
The patent introduces a common line layer as an intermediary structure between the signal line layer and the color filter layer. When a signal line is disconnected, the repair process uses the common line layer as a mediator to establish new connections through via holes, avoiding direct heat application to the color filter layer that would cause damage.
Solution Approach 2:
The patent segments the conductive line structure into signal lines and common lines with different functions. The common lines are specifically designed to be accessible from the color filter layer side for repair purposes, allowing disconnection repairs to be performed on signal lines by connecting to common lines without directly heating the color filter layer.
2Ease of repair
If via holes are created in the color filter layer to access signal lines for repair, then disconnected signal lines can be reconnected, but the color filter layer integrity is compromised
Solution Approach 1:
The common line layer is pre-configured with specific geometric patterns and positions during manufacturing, creating predetermined access points and pathways. This preliminary arrangement enables future repair operations to be performed by simply forming via holes at these pre-planned locations, making the repair process easier while maintaining color filter layer integrity through design.
Data Source
AI summary
An array substrate, a manufacturing method and a maintenance method thereof, and a display device. The array substrate includes a base substrate, a signal line layer, a color filter layer, and a common line layer. The signal line layer includes multiple signal lines. The common line layer includes a plurality of first common lines and second common lines. An orthographic projection of each signal line on the base substrate is substantially parallel to an orthographic projection of each second common line on the base substrate. An orthographic projection of each signal line on the base substrate and orthographic projections of the plurality of first common lines on the base substrate have overlapping areas. A via hole penetrates the color filter layer, and an orthographic projection of the via hole on the base substrate at least partially overlaps the overlapping area.