Array Substrate Via Holes for Bending Stress Reduction
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Solution Overview
Problem
Curved liquid crystal display screens face stress issues due to brittle inorganic materials, leading to breakage and display defects when bent, particularly with metal traces causing bright or dark lines.
Innovation Solution
Defining via holes between adjacent thin film transistors in a bending region that penetrate through the thin film transistor layer, filled with an organic layer to reduce stress and prevent crack propagation in metal traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display screen is bent to achieve curved display, then the viewing angle is widened and product differentiation is achieved, but the film stress increases and films easily break
Solution Approach 1:
The patent divides the continuous inorganic film layer into segmented sections by introducing via holes that penetrate through the inorganic film. This segmentation allows the film to flex independently in each segment, reducing stress concentration during bending while maintaining the overall structural integrity and display functionality.
2Shape
If the display screen is bent with small curvature radius, then the curved display effect is achieved, but the brittle inorganic materials (metal traces, insulating layers, transparent electrodes) easily break
Solution Approach 1:
The inorganic film is segmented by via holes, creating discrete sections that can accommodate bending stresses. This segmentation prevents crack propagation across the entire film, allowing the structure to maintain strength during bending with small curvature radius.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the inorganic film is continuous in non-bending regions for optimal electrical performance, while in bending regions it is segmented via via holes to accommodate mechanical stress. This local differentiation optimizes both electrical functionality and mechanical durability.
3Reliability
If metal traces are used in the array substrate, then electrical connectivity is achieved, but breakage causes defects such as bright lines or dark lines affecting display quality
Solution Approach 1:
The metal trace continuity is maintained while the underlying inorganic film is segmented by via holes. This approach preserves electrical connectivity through the metal traces while the segmented inorganic film prevents stress-induced breakage, thereby eliminating the root cause of display defects like bright or dark lines.
Data Source
AI summary
An array substrate and a method of manufacturing thereof are provided. The array substrate includes a substrate, a buffer layer, a plurality of thin film transistors, an organic layer, and a first electrode. By defining a via hole between two adjacent thin film transistors in the bending region, the via hole penetrates through the passivation layer, the gate insulating layer, and the first metal trace, which can effectively reduce stress between the passivation layer and the gate insulating layer.