Array Substrate Test Groove Layout to Prevent Probe Burn

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Solution Overview

Problem

Current test structures in array substrates face issues with probe burn during testing due to small groove sizes, leading to inefficiencies and potential damage during signal transmission.

Innovation Solution

The array substrate incorporates a test structure with grooves of varying sizes, where the third groove has an opening size greater than or equal to 300 μm, allowing for safe probe insertion and connection between conductive layers without burn phenomena, optimizing groove distribution and size for effective signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the groove size is designed to be small (tens of microns) to increase the number of grooves, then the quantity of testable points increases, but probe burn occurs during testing

Engineering Contradiction:
Improvenumber of groovesVSAvoidprobe burn
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by differentiating groove sizes based on their functional requirements. The first and second grooves (for conductive layers) are small (tens of microns) to maximize quantity, while the third groove (for probe contact) is large (≥300 microns) to prevent burn. This localized differentiation allows each groove to be optimized for its specific purpose, resolving the contradiction between quantity and safety.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The test structure is segmented into multiple groove types with different sizes. Instead of using uniform small grooves throughout, the patent divides the groove system into: (1) small grooves for conductive layer access, (2) another set of small grooves for additional conductive layers, and (3) large grooves specifically for probe insertion. This segmentation allows the system to achieve both high quantity of test points and safe probe operation.

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If the groove size is increased to prevent probe burn, then probe safety improves, but the number of grooves that can be accommodated decreases

Engineering Contradiction:
Improveprobe burn preventionVSAvoidnumber of grooves
Core Design Contradiction:
Object-affected harmful factorsVSQuantity of substance

Solution Approach 1:

Rather than uniformly increasing all groove sizes, the patent applies local quality by making only the third groove (which contacts the probe) large (≥300 microns) to prevent burn. The first and second grooves remain small (tens of microns) to maximize the number of grooves that can be fitted on the substrate. This selective size differentiation resolves the contradiction between safety and quantity.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If two conductive layers are provided with grooves to improve wiring flexibility, then wiring flexibility improves, but the complexity of the test structure increases

Engineering Contradiction:
Improvewiring flexibilityVSAvoidtest structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The test structure uses multi-functionality by having the third groove serve multiple purposes: it provides electrical connection between conductive layers, accommodates the test probe, and enables signal transmission. The first and second grooves similarly serve dual purposes of electrical connection and structural organization. This multi-functional design achieves wiring flexibility without proportionally increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges multiple functions into the groove structure itself. The grooves simultaneously provide: (1) electrical connection pathways between conductive layers, (2) structural organization for the test signal transmission path, and (3) access points for probe insertion. By combining these functions into a single integrated groove system rather than separate components, the wiring flexibility is achieved with controlled complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11798957B2Array substrate, display panel and large glass panel
Publication Date: 2023.10.24 HKC CORP LTD
  • US11798957B2 patent drawing
  • US11798957B2 patent drawing
  • US11798957B2 patent drawing

AI summary

The present disclosure relates to an array substrate, a display panel, and a large glass panel. The array substrate includes a test structure. The test structure includes a substrate, and a first conductive layer, an insulating layer, a second conductive layer, and a passivation layer sequentially stacked on the substrate. The passivation layer is provided with at least one first groove, at least one second groove, and one third groove. An opening size of the third groove is greater than opening sizes of the at least one first groove and the at least one second groove. The first groove penetrates through the passivation layer and extends to the first conductive layer. The second groove penetrates through the passivation layer and extends to the second conductive layer. The third groove penetrates through the passivation layer and extends to the first conductive layer or the second conductive layer.