Articulating Transfer Head Layout for High-Throughput Micro Device Transfer
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Solution Overview
Problem
Integration and packaging issues, particularly in transferring micro devices like RF MEMS microswitches, LEDs, and quartz-based oscillators, are hindered by traditional transfer methods that involve de-bonding the transfer wafer and require extensive cycle times due to sequential pick and place operations.
Innovation Solution
The implementation of a mass transfer tool (MTT) with multiple articulating transfer head assemblies and transfer lanes, including looped configurations, to increase throughput by enabling simultaneous pick-up and placement of micro devices across multiple substrates, incorporating features like electrostatic transfer heads, counter-weights, and integrated inspection and cleaning stations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional sequential pick and place operations are used, then device transfer accuracy is maintained, but tool cycle time increases and productivity decreases
Solution Approach 1:
The transfer tool is divided into multiple independent transfer heads (first, second, third, and fourth transfer heads) that can operate simultaneously on different substrates. Each transfer head functions as an independent unit, allowing parallel execution of pick and place operations across multiple substrates, thereby reducing overall cycle time while maintaining transfer accuracy.
Solution Approach 2:
The system maintains continuous operation by having multiple transfer heads working in parallel without idle time. While one transfer head completes a transfer operation, another is already positioned for the next operation, eliminating downtime between cycles and maintaining continuous productive action across the system.
2Productivity
If multiple transfer heads operate on multiple substrates simultaneously, then productivity increases, but system complexity increases
Solution Approach 1:
Each transfer head is designed as a universal module capable of performing the same pick and place functions on different substrates. This modular universality allows the system to handle multiple substrates with identical operational capabilities, reducing the need for specialized components and simplifying system control despite the increased number of transfer heads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces cycle time and increases productivity by allowing simultaneous operations across multiple substrates, reducing travel distance, and integrating inspection and cleaning processes, thereby enhancing the efficiency of micro device transfer and placement.
Implementation Method 1
the transfer heads operate in accordance with principles of electrostatic grippers, using the attraction of opposite charges to pick up the micro devices
Data Source
AI summary
Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a plurality of articulating transfer head assemblies coupled with a main translation track, where each articulating transfer head assembly is translatable along the main translation track between a donor substrate stage and a receiving substrate stage.