ASIC and Silicon Photonics Copackaging Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Designing a module with electronic and optical components that efficiently manages power distribution, heat dissipation, and maintains a benign temperature range for photonic integrated circuits while minimizing voltage drops and ensuring short power conductors.
Innovation Solution
A module with a substrate having conductive traces and multiple contact types, including wire bond pads and copper pillars, that securely connects electronic and photonic integrated circuits, incorporates thermal management through a metal cover with a low thermal resistance path and uses photonic integrated circuit assemblies with mode converters and V-groove blocks to handle optical fibers, along with heaters and temperature sensors for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic integrated circuit is placed on the substrate with multiple contacts, then the electrical connections are established, but the power conductor length increases causing voltage drops
Solution Approach 1:
The patent transitions from a conventional planar substrate layout to a three-dimensional stacked architecture where the electronic integrated circuit is vertically positioned above the substrate. This dimensional change allows power conductors to be routed vertically through the stack, significantly reducing the horizontal distance and length of power delivery paths, thereby minimizing voltage drops while maintaining reliable electrical connections.
Solution Approach 2:
The patent introduces an intermediary substrate structure that acts as a bridge between the electronic integrated circuit and the external environment. This substrate includes multiple contact pads and conductive traces that optimize the power distribution network, providing short and direct power delivery paths from the power sources to the electronic circuit while maintaining signal integrity and electrical stability.
2Use of energy by moving object
If the electronic integrated circuit operates at low voltage (0.9V), then power consumption is reduced, but voltage drops become more significant
Solution Approach 1:
By adopting a three-dimensional stacked architecture, the patent reduces the horizontal distance power must travel across the substrate. The vertical stacking allows power conductors to connect directly below the electronic integrated circuit, minimizing the length of low-voltage signal paths and reducing the impact of voltage drops, thereby enabling stable operation at low voltages with reduced power consumption.
Solution Approach 2:
The substrate is designed with local optimization of conductive traces and contact pads positioned specifically to minimize resistance in critical power delivery paths. The contact arrangement provides direct, short connections from power sources to the electronic integrated circuit, creating low-resistance zones that maintain voltage stability even at low operating voltages.
3Productivity
If photonic integrated circuits are placed near the electronic integrated circuit, then integration density is improved, but heat management becomes more difficult
Solution Approach 1:
The patent segments the integrated circuit system into distinct functional layers: the electronic integrated circuit in one layer and the photonic integrated circuits in another layer within the stack. This vertical segmentation allows independent thermal management for each component type, enabling heat to be dissipated from the electronic circuit through one path while the photonic circuits operate in a separate thermal zone, thus maintaining high integration density while simplifying temperature control.
Solution Approach 2:
By transitioning from a planar side-by-side arrangement to a vertical stacked configuration, the patent separates the thermal domains of electronic and photonic circuits into different spatial zones. This three-dimensional arrangement allows independent thermal management strategies for each component, reducing thermal interference while maximizing integration density through vertical stacking.
4Adaptability or versatility
If multiple contact types (solder, wire bond pads) are used, then connection flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate contact pads are designed with multi-functionality to accommodate different connection types. The same contact pad structure can serve as a solder mounting point, a wire bond anchor, or a direct electrical connection point depending on the specific application requirements. This universal contact design provides connection flexibility while maintaining a standardized manufacturing process, thereby reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance, maintains optimal temperature conditions, and ensures efficient data processing and transmission while minimizing voltage drops, thus enhancing the performance and reliability of the module.
Implementation Method 1
incorporates thermal management through a metal cover with a low thermal resistance path
Implementation Method 2
each contact of the first plurality of contacts is secured to a contact of the second plurality of contacts with solder
Data Source
AI summary
A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.