Photonic directional couplers leverage waveguide dispersion to tune spectral entanglement and photon time ordering.
A first insulating layer extends above adjacent electrodes to prevent foreign matter adhesion on optical waveguide devices.
Lateral web regions thermally couple heat sources to waveguides, reducing optical absorption losses while maintaining efficient resonator heating.
A depressed cladding waveguide structure confines optical signals within a composite electro-optical substrate to enable high-speed modulation.
Vertical output couplers use tilted mirrors to extract light from waveguides, enabling on-wafer testing without chip-level polishing.
A T-shaped arrayed waveguide grating uses asymmetric geometry to support a large free spectral range in a compact form factor.
Vertical stacking minimizes voltage drops while a metal cover reduces thermal resistance, maintaining optimal temperatures for reliable data transmission.
Gradual width and separation changes in an adiabatic waveguide coupler minimize back-reflections that limit resonator fiber optic gyroscope bias stability.
PECVD silicon dioxide cladding with refractive index below 1.3 mitigates porous film density issues, boosting light confinement.
Downwardly extending ground electrode portions confine electrical fields to reduce crosstalk and frequency losses in RF waveguide arrays.
Non-overlapping electrode placement prevents dielectric damage and short-circuits, improving optical waveguide reliability.
Optical coupling and branch part segments modulated light into monitoring and output waveguides to preserve signal intensity.
A signal layer generates spectral signals to control etching depth accuracy in silicon photonic platforms.
Vertical waveguides and mirrored facets reduce MZI footprint by half while eliminating waveguide crossings.
A monolithic waveguide-integrated photodiode merges the depleted drift layer with the waveguide core to enhance light coupling efficiency.
A silicon nitride polarization splitter rotator uses overlapping waveguides to rotate optical signals.
A light sensor uses a segmented wet etch process to polish the interface between crystalline media and absorption layers.
Ge and GaAs buffer layers in a substrate cavity enable epitaxial growth of III-V stacks on SOI, overcoming lattice mismatch for efficient light modulation.
Opposite-side stiffeners balance mechanical loads on a photonic integrated circuit, reducing laser channel stress gradients by over 80%.
Oxide claddings in a polarization rotator-splitter enable mode conversion while minimizing crosstalk and conversion loss.
An optical diode leverages spin-orbit coupling to achieve directional light propagation in a compact waveguide structure.
Nested conical traps in a stratum spatially separate spectral components by frequency, reducing device complexity compared to conventional refractive optics.
A curved optical waveguide matches propagation constants to enable efficient evanescent coupling into a preferred radial mode within a passive optical cavity.
A reactive silicone composition forms optical waveguides with high refractive index.
Vanadate waveguide absorbers lower optical return loss and crosstalk while maintaining signal integrity in photonic devices.
Fang-based capacitive structures decouple capacitance from inductance, resolving impedance matching trade-offs while reducing signal reflection loss.
A stacked waveguide core structure with overlapping tapered sections enables efficient light coupling between multiple layers.
An asymmetric waveguide coupling structure enables controlled mode conversion through deliberate index asymmetry.
A method bonds a processed III-V semiconductor layer to a patterned silicon substrate for integrated circuit fabrication.
Multi-segmented tapered evanescent couplers relax sub-micron alignment tolerances, enabling high-speed data transfer in co-packaged integrated circuits.
Angled sidewalls on a tapered dielectric layer reduce absorption and back reflection, enabling long-range routing of optical signals.
A plasmonic switching device modulates electromagnetic radiation through a resonant cavity with adjustable operational characteristics.
A disk resonator optical modulator uses a composite silicon structure to achieve high-speed signal modulation.
Reducing substrate thickness to 30 μm enables tighter curvature while maintaining mechanical strength and minimizing cross-talk.
Concentric arcuate portions with increasing central angles and oppositely bending connectors reduce radiation loss in folded optical modulators.
Embedding waveguides in a component cavity reduces board surface space usage and improves airflow interference for high-speed data interconnections.
Crystallographic etching creates smooth silicon nitride waveguide sidewalls, eliminating scattering losses from surface roughness in tapered mode converters.
Feedback control system stabilizes optical ring resonance by adjusting doped region heat, reducing power consumption and thermal sensitivity.
Pedestals and optical adhesive enable passive alignment of semiconductor optical amplifiers on silicon photonics chips.
Computing width-dependent scattering rates across process corners defines the envelope for a non-linear taper, reducing optical transmission losses.
A silicon nitride waveguide core forms via low-pressure chemical vapor deposition using deuterated silane to eliminate hydrogen incorporation.
A photonics structure with a waveguide and an optical attenuator using a Gaussian doping profile to absorb electromagnetic waves.
Elevated deposition temperatures minimize propagation losses by reducing N-H bonds while avoiding dopant diffusion during subsequent processing.
Graded quantum well structures minimize refractive index discontinuities at boundaries, reducing light loss and improving coupling efficiency.
A first wiring electrode extends vertically from a signal electrode end to space away from an optical waveguide.
Introducing a heterogeneous coupling element increases evanescent field interaction to reduce the directional coupler footprint on photonics chips.
An asymmetrically-loaded GSG traveling wave electrode configuration shields signal conductors with ground lines to enhance electrical isolation in optical modulators.