Modular Active Board Subassemblies for Optical Interconnects
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Solution Overview
Problem
High-speed data interconnections in computer systems require efficient optical links, but traditional optical cables and connectors occupy valuable space on printed wiring boards, interfere with airflow, and complicate cooling, necessitating an alternative optical interconnect solution.
Innovation Solution
A modular active board subassembly with a substrate board and transceiver system that recesses waveguides and transceivers within a component cavity, allowing for optical signal conversion and electrical signal transmission without surface-mounted connectors, thereby reducing space usage and airflow interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional optical cables and connectors are used on printed wiring boards, then optical signal transmission is achieved, but valuable board surface space is occupied and airflow is interfered with
Solution Approach 1:
The patent transitions optical connectors from a two-dimensional surface mounting approach to a three-dimensional embedded approach. Waveguides are routed through vertical vias and embedded within the board thickness, allowing optical signals to be transmitted without occupying precious surface area. The waveguide array is positioned in a plane below the component mounting surface, effectively utilizing the Z-dimension to resolve the space conflict.
Solution Approach 2:
The waveguide structure is nested within the printed wiring board itself. The waveguides are embedded in recesses or cavities formed within the board substrate, with coupling structures nested at the board edges. This nesting approach allows the optical interconnect to be contained within the board volume rather than extending outward, preserving surface area for other components.
2Reliability
If traditional optical cables and connectors are used on printed wiring boards, then optical signal transmission is achieved, but airflow is interfered with and cooling is adversely impacted
Solution Approach 1:
The patent extracts the optical signal transmission function from the surface level and relocates it to the internal volume of the board. By embedding waveguides within the board substrate and positioning the waveguide array below the component mounting surface, the design removes the optical interconnect elements that would otherwise obstruct airflow patterns necessary for cooling electronic components.
3Reliability
If waveguides are extended to the peripheral edge of the substrate, then optical signal transmission is achieved, but alignment precision requirements increase
Solution Approach 1:
The patent incorporates preliminary alignment features directly into the board fabrication process. Recesses, cavities, and guide structures are pre-formed during board manufacturing to establish precise reference geometries for waveguide placement. This preliminary action ensures that waveguides are automatically positioned with high precision relative to the board edges and component locations, eliminating the need for post-fabrication alignment adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient high-speed data interconnections without occupying additional surface area on printed wiring boards, improving airflow and cooling, and simplifying assembly by allowing independent alignment of waveguide components, reducing RF interference and assembly precision requirements.
Implementation Method 1
A waveguide may be positioned in the component cavity and extend from the outboard edge of the substrate to the transceiver. The waveguide may be coupled to the transceiver.
Implementation Method 2
The transceiver may be electrically coupled to conductors on the attachment surface and electrically coupled to electrical contacts on an upper surface of the sidewall.
Data Source
AI summary
A modular active board subassembly for coupling a waveguide array to an electrical component on a printed wiring board may include a substrate board with a sidewall extending around at least a portion of an attachment surface of the substrate board and forming a component cavity on the attachment surface. A transceiver may be disposed in the component cavity proximate an inboard edge of the substrate board. The transceiver may be electrically coupled to conductors on the attachment surface and electrically coupled to electrical contacts on an upper surface of the sidewall. A waveguide may be positioned in the component cavity and extend from the outboard edge of the substrate to the transceiver. The waveguide may be coupled to the transceiver.