Assembly Substrate Shielding Layout for Precise Micro LED Transfer
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Solution Overview
Problem
Current methods for manufacturing large-screen displays using micro-sized semiconductor light emitting diodes face challenges in transfer precision and mis-assembly, particularly during self-assembly processes, which affect the reliability and efficiency of the display manufacturing process.
Innovation Solution
An assembly board is designed with a base portion, assembly electrodes, a dielectric layer, barrier ribs, and a metal shielding layer to guide semiconductor light emitting diodes to preset positions using electric and magnetic fields, preventing mis-assembly by shielding electric fields in unnecessary areas and ensuring precise placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly technology is used to transfer micro LEDs, then productivity is improved, but manufacturing precision deteriorates due to mis-assembly between diodes and barrier ribs
Solution Approach 1:
The assembly board is divided into multiple cells, each containing a barrier rib structure that segments the transfer area. This segmentation allows individual micro LEDs to be guided and assembled into specific positions within each cell, improving precision while maintaining high throughput through parallel processing of multiple cells
Solution Approach 2:
A barrier rib is introduced as an intermediary structure between the micro LED and the final assembly position. The barrier rib guides the micro LED during self-assembly, preventing mis-assembly and ensuring precise positioning without requiring complex external manipulation equipment
2Ease of operation
If electric field is applied for self-assembly, then ease of operation is improved, but harmful factors increase due to electric field interference in unnecessary areas
Solution Approach 1:
The electric field is applied locally only in the necessary areas for self-assembly using selectively positioned electrodes. The barrier rib structure creates local field confinement, ensuring that electric field effects are concentrated where needed for guiding micro LEDs while minimizing interference in surrounding areas
Solution Approach 2:
The harmful electric field interference is extracted and removed from unnecessary areas by confining the electric field generation to specific electrode regions. The barrier rib structure acts as a boundary that extracts and contains the electric field effect to only where it is needed for assembly control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-reliability, low-cost, and high-efficiency transfer of micro LEDs onto large-area substrates, improving transfer precision and preventing mis-assembly, thus facilitating the production of large-area display devices with improved yield and reduced defects.
Implementation Method 1
semiconductor light emitting diodes to be seated at preset positions of the assembly board using an electric field and a magnetic field
Implementation Method 2
the metal shielding layer overlaps a portion of the seating surfaces such that an electric field formed on the portion of the seating surfaces is shielded
Data Source
AI summary
The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.