Assisted Condensation Cooling for Semiconductor Heat Control
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Solution Overview
Problem
Semiconductor devices face challenges in thermal management due to heat dissipation issues, which can impact performance and require efficient cooling methods to maintain operational integrity during testing and use.
Innovation Solution
A fluid-based multi-phase cooling system with assisted condensation is employed, utilizing a thermal management system that includes heating and cooling units, fluid reservoirs, and condensation conduits to regulate temperature and pressure independently in thermal test chambers and semiconductor device systems, using fluids like water or hydrofluoroether to manage heat through vapor and liquid phases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling or liquid cooling is used to dissipate heat from semiconductor devices, then heat dissipation capability is improved, but device complexity and thermal management system complexity increase
Solution Approach 1:
The patent employs phase change material (PCM) that transitions from solid to liquid state to absorb and store heat energy from semiconductor devices. This phase transition mechanism provides passive thermal management without requiring complex active cooling systems, pumps, or heat sinks, thereby improving heat dissipation capability while reducing system complexity
Solution Approach 2:
The thermal management system utilizes the inherent phase change properties of the PCM to automatically absorb and store heat without external control or power input. The system self-regulates temperature by leveraging the natural thermodynamic behavior of the phase change material, eliminating the need for complex control systems and reducing overall device complexity
2Reliability
If high temperatures are applied during burn-in testing to ensure device reliability, then device reliability is improved, but thermal stress on devices increases
Solution Approach 1:
The patent utilizes the phase change temperature of the PCM as a controllable parameter to regulate the maximum temperature experienced by semiconductor devices during burn-in testing. By selecting PCMs with appropriate phase change temperatures, the system maintains temperatures high enough to ensure reliability while preventing excessive thermal stress that could damage devices
Solution Approach 2:
The phase change material acts as an intermediary thermal buffer between the heating source and the semiconductor devices. It absorbs excess thermal energy during phase transition, moderating temperature fluctuations and reducing thermal stress on devices while still providing sufficient thermal conditions for reliable burn-in testing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively controls temperature and pressure variations, ensuring reliable semiconductor device performance by minimizing thermal stress and maximizing efficiency and energy efficiency in thermal test chambers and semiconductor device systems.
Implementation Method 1
A diameter of the fluid return conduit can be between 0.25 inches and 0.75 inches... utilizing a thermal management system that includes heating and cooling units, fluid reservoirs, and condensation conduits to regulate temperature and pressure independently in thermal test chambers and semiconductor device systems, using fluids like water or hydrofluoroether to manage heat through vapor and liquid phases
Implementation Method 2
Two-phase cooling with assisted condensation for semiconductor devices... a fluid condensation conduit that is capable of supplying cooled fluid to the fluid outflow conduit
Implementation Method 3
The operation of a semiconductor device can create heat which can be dissipated, for example, through air cooling or liquid cooling
Data Source
AI summary
Systems for heat management of semiconductor systems are provided. The heat management systems can provide liquid cooling or heating for a plurality of semiconductor devices under test. The systems are also useful for liquid cooling of computing systems, such as datacenters.