Light-emitting Package Asymmetric Chip Height for Uniform Color Temperature
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Solution Overview
Problem
Current light-emitting packages face challenges in achieving uniform color temperature and contrast across different viewing angles due to variations in light emission from multiple chips, leading to non-uniform brightness and color appearance.
Innovation Solution
A light-emitting package design featuring a substrate with multiple light-emitting chips of different colors arranged in specific configurations, where the chips are positioned with varying distances from the molding layer and grooves on the molding layer to optimize light emission and reduce color temperature differences, ensuring uniform light emission and improved contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple light-emitting chips are arranged in a conventional configuration with uniform spacing, then the device complexity is reduced and manufacturing is easier, but the color temperature uniformity and brightness uniformity across different viewing angles deteriorate
Solution Approach 1:
The patent applies asymmetry by configuring multiple light-emitting chips at different heights relative to the molding layer, with at least one chip positioned at a first height and another chip at a second height different from the first height. This asymmetric vertical arrangement compensates for viewing angle dependencies, maintaining uniform color temperature and brightness appearance across different observation angles while remaining manufacturable through standard chip mounting processes.
2Device complexity
If multiple light-emitting chips are arranged in a conventional configuration with uniform spacing, then the device structure is simpler, but the brightness uniformity and contrast across different viewing angles deteriorate
Solution Approach 1:
The patent employs asymmetric vertical positioning of light-emitting chips at different heights above the molding layer. This configuration optimizes light emission paths for different viewing angles, ensuring that the combined light output maintains uniform brightness appearance and contrast across wide viewing angles, while the overall device structure remains relatively simple and manufacturable.
3Manufacturing precision
If light-emitting chips are positioned at the same height from the molding layer, then the manufacturing process is simpler and more consistent, but the color appearance and contrast uniformity across viewing angles deteriorate
Solution Approach 1:
The patent implements asymmetric vertical positioning where at least one light-emitting chip is positioned at a first height and another chip is positioned at a second height different from the first height. This controlled asymmetry in chip positioning compensates for viewing angle effects, maintaining uniform color appearance and contrast across different observation angles while remaining compatible with standard manufacturing processes that can accommodate varied chip heights.
4Device complexity
If conventional light-emitting chip arrangements are used, then the device structure is simpler, but the light efficiency and color temperature control across different viewing angles deteriorate
Solution Approach 1:
The patent utilizes asymmetric vertical arrangement of light-emitting chips at different heights to optimize light extraction and emission efficiency. By positioning chips at varied heights, the structure enhances light output in multiple directions and improves overall light efficiency while maintaining a relatively simple device structure that is easy to manufacture and assemble.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances light efficiency, maintains uniform color temperature across viewing angles, and improves contrast by allowing for precise control of light emission from the top and side surfaces, resulting in consistent brightness and color appearance.
Implementation Method 1
Light-emitting diodes emit light converted from energy due to recombination of electrons and holes contained in combined semiconductors
Implementation Method 2
a molding layer on a top surface of the substrate, the molding layer covering the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip
Data Source
AI summary
A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.