Asymmetric Conductive Layer Spacing for Display Panel Adhesion
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Solution Overview
Problem
The challenge in display panel manufacturing is the poor adhesion between copper conductive layers and substrates, leading to delamination and impedance mismatch issues, which affect the reliability and performance of display devices.
Innovation Solution
The design involves a first conductive layer with a larger spacing exposed by a second conductive layer, where the second conductive layer has a smaller line width than the first, and the spacings between their sidewalls are asymmetrical, preventing breakage due to over-etching and reducing impedance mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper manufacturing processes are used to replace aluminum, then resistance is reduced and crosstalk is reduced, but adhesion between copper and substrate deteriorates causing delamination
Solution Approach 1:
The patent employs a multi-layer composite structure consisting of aluminum alloy layer (first conductive layer) and copper layer (second conductive layer). The aluminum alloy layer provides excellent adhesion to the substrate, while the copper layer provides low resistance and reduced crosstalk. This composite material approach allows the system to simultaneously achieve both good adhesion and low resistance, resolving the technical contradiction between these two properties.
Solution Approach 2:
The conductive system is segmented into multiple functional layers: the aluminum alloy layer handles the adhesion function to the substrate, while the copper layer handles the low-resistance signal transmission function. By dividing the conductive system into separate layers with specialized functions, each layer can be optimized for its specific purpose without compromising the other, thus resolving the contradiction between adhesion and resistance.
2Ease of manufacture
If symmetric spacing is used between conductive layers, then manufacturing is simplified, but over-etching causes breakage and impedance mismatching occurs
Solution Approach 1:
The patent introduces asymmetric spacing between the sidewalls of the first and second conductive layers. Specifically, the spacing on one side (first spacing) is designed to be larger than the spacing on the other side (second spacing). This asymmetric design compensates for potential over-etching effects during manufacturing, ensuring that the conductive layers maintain proper alignment and spacing even when etching variations occur, thereby preventing breakage and impedance mismatching.
Solution Approach 2:
The asymmetric spacing design acts as a pre-built buffer against manufacturing variations. By deliberately creating unequal spacing, the design anticipates and compensates for potential over-etching that might occur during the manufacturing process. This beforehand cushioning ensures that even if etching runs deep, the conductive layers will not break or experience impedance mismatching, thus maintaining reliability.
Data Source
AI summary
A display panel and a display device applying the same are provided. The display panel includes a first substrate, a second substrate, and a display medium disposed between the first substrate and the second substrate. The first substrate includes a first conductive layer having a first line width and a second conductive layer having a second line width smaller than the first line width. A first spacing is defined by a first sidewall of the second conductive layer and a second sidewall, located on the same side as the first sidewall, of the first conductive layer. A second spacing is defined by a third sidewall of the second conductive layer opposite to the first sidewall and a fourth sidewall, located on the same side as the third sidewall, of the first conductive layer. The first spacing is greater than the second spacing.