Asymmetric Laser Via for Component Carrier Reliability
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Solution Overview
Problem
The challenge in component carriers is to provide a reliable via with a small size while maintaining mechanical robustness and electrical reliability, especially as designs become denser and line widths and via diameters decrease, leading to issues with signal integrity and stress energy concentration.
Innovation Solution
A component carrier with a laser via that has a connection diameter equal to or larger than the opening diameter, filled with an electrically conductive material, is manufactured using laser drilling and electroplating, shifting stress energy concentration to a more easily reinforced location and improving via reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the via diameter is reduced to achieve smaller line width and spacing, then the density of the component carrier increases, but the reliability of the via deteriorates
Solution Approach 1:
The patent applies asymmetry by creating a via structure where the connection diameter at the first end (CD) is different from the opening diameter at the second end (OD), specifically making CD equal to or larger than OD. This asymmetric geometry redistributes stress energy away from the critical connection region to the opening region, maintaining via reliability even when the overall via size is reduced for higher density applications.
2Productivity
If the via size is reduced to accommodate denser designs, then more components can be mounted, but stress energy concentration increases at the via connection
Solution Approach 1:
The patent applies local quality by creating a via structure with different diameters at different locations. The connection diameter (CD) at the first end is made equal to or larger than the opening diameter (OD) at the second end, concentrating the structural strength where it is most needed (at the connection to the conductive layer) while allowing the opening to be smaller for dense routing. This local differentiation of via dimensions optimizes both stress distribution and space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of small-sized vias by efficiently reinforcing the structure against stress energy, improving the overall performance of the component carrier without sacrificing reliability, making it suitable for applications with tight line spacing and small via widths.
Implementation Method 1
forming a laser via, in particular by using laser drilling, in the electrically insulating layer structure
Implementation Method 2
the laser via is at least partially filled with an electrically conductive material
Data Source
AI summary
A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.