Semiconductor/Solid-State Device Details TRIZ Cases
- Dummy Block Warpage Control in Semiconductor Packaging
Placing dummy blocks with intermediate thermal expansion coefficients controls wafer curvature, improving yield and patterning efficiency.
- Wafer Level CSP Opaque Encapsulation
Opaque encapsulation blocks light exposure while full coverage prevents chipping.
- Magnetic Shield with In-Plane Magnetization for MRAM
In-plane magnetization overcomes diamagnetic interference that limits perpendicular anisotropy, boosting permeability and shielding effectiveness.
- Superimposed Fin Groups and Parallel Heatpipes for Uniform Cooling
Segmented fin groups connected to parallel heat pipes resolve the trade-off between adaptability to varying heat outputs and uniform cooling performance.
- Auxiliary Photodetector Enables Wafer-Level Transimpedance Amplifier Testing
An auxiliary integrated silicon photodetector stimulates a transimpedance amplifier for functional verification on the wafer before packaging.
- Convex Under-Bump Metal Layer for Semiconductor Terminal
A convex under-bump metal layer configuration stabilizes the terminal structure interface.
- Silicon-Germanium Bonding with Buffer Layers to Reduce Shear Stress
A silicon or germanium bonding method uses a eutectic layer and buffer layers to manage thermal expansion differences between parts.
- Self-Aligned GaN FinFET Fabrication via Sacrificial Gate
A self-aligned GaN FinFET process uses a sacrificial gate to define precise source-drain spacing.
- Inclined Side Wall Semiconductor Package Shielding
A semiconductor package uses inclined side walls to enable uniform conductive shield layer deposition on complex surfaces.
- Wire Bond Coating Removal for Corrosion Control
Removing coating segments exposes underlying metal to increase the anode area, slowing corrosion rates at unintentional bond sites.
- Interconnect Substrate for Multi-Component Package Size Reduction
An interconnect substrate mounts discrete components directly on a die to increase connectivity density within a multi-component package.
- Wafer Shield Tunnel Formation via Backside Laser Inversion
Backside laser application forms shield tunnels through adhesive tape to divide wafers without front-side interference.